텍사스 인스트루먼트(TI)는 컨셉에서 프로토타입까지 단 몇 분 만에 구현할 수 있도록 지원하는 새로운 프로그래머블 로직 디바이스(PLD)를 출시하며, 코딩이 필요 없는 툴로 설계의 복잡성을 줄여 보드 공간, 개발 시간 및 비용을 절감할 것으로 기대가 모아진다.
Programmable logic devices launched, reducing board space, development time, and cost
The programmable logic portfolio is expected to support implementation from concept to prototype in minutes, reducing design complexity with no-coding tools, saving board space, development time and costs.
Texas Instruments (TI) today announced the launch of new programmable logic devices (PLDs) that build on its industry-leading logic portfolio and simplify logic design for any application.
TI's new PLD portfolio, which integrates up to 40 combinational and sequential logic and analog functions into a single device, can reduce board size by up to 94 percent and lower system costs compared to discrete logic implementations.
Additionally, the new portfolio offers significant space savings compared to similar programmable logic devices on the market.
Engineers can design, simulate and configure evaluation devices in minutes without any software coding using TI's easy-to-use InterConnect Studio tool.
InterConnect Studio accelerates the logic design process with a drag-and-drop GUI and integrated simulation capabilities.
Designers also have programming and purchasing Accelerate time to market with click-to-program and direct order capabilities that streamline the process to one click.
“Increasingly, engineers are looking to programmable logic devices as a way to reduce design complexity and board space, streamline supply chain management and accelerate time to market,” said Tsedeniya Abraham, vice president and general manager of TI’s Interface segment. “Traditional programmable logic devices are either more complex than the application demands, require programming expertise or offer limited packaging options. TI’s new programmable logic portfolio builds on TI’s 60 years of experience in logic design by offering a small form factor, low power consumption, AEC Q-100 qualification and an operating temperature range of -40°C to 125°C in an industry-standard package as small as 2.56 mm2 for applications including automotive, industrial and personal electronics.”
TI's PLD portfolio includes the industry's smallest leaded package across all markets, measuring 2.1 mm x 1.6 mm with a pitch of 0.5 mm.
This lead package meets the needs of manufacturers requiring soldering with a 92 percent smaller footprint than competitive products. TI's automotive-grade PLDs are up to 63 percent smaller than competitors. The portfolio also offers quad flat no-lead (QFN) packaging options that enable automated optical inspection, ensuring safety and long-term system reliability.
TI's new PLDs consume less than 1μA of standby current and 50 percent less active power than similar products, helping extend battery life in products such as electric vehicles, power tools, battery packs and game controllers.
All products in the newly introduced PLD portfolio support general-purpose inputs/outputs, lookup tables, digital flip-flops, pipe delays, filters, and RC oscillators.
Additionally, the TPLD1201 and TPLD1202 devices integrate analog functions such as an analog comparator and provide internally selectable voltage reference options and hysteresis. The TPLD1202 also provides additional features such as a serial peripheral interface (SPI), I2C, watchdog timer, and state machine.
Pre-production quantities of the new PLD product portfolio are available on TI.com.