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Silicon Labs Supports Simplifying IoT Product Design with New Mesh Networking Module

Google 우선 소스Published2019.10.04 10:28
| Simplify the development of smart LED, home automation, and industrial IoT solutions with pre-certified Zigbee, Thread, and Bluetooth Mesh modules


Shortening product launch times is a challenge that IoT product developers must address and is a key factor in product competitiveness.
Silicon Labs Launches Mesh Networking Module to Simplify IoT Product Design (Image = Silicon Labs)

Silicon Labs released a new Wireless Gecko module on the 1st to help IoT developers reduce product development costs and design complexity.

The new MGM210x and BGM210x Series 2 modules support mesh protocols such as Zigbee, Thread, and Bluetooth Mesh, as well as Low Power Bluetooth and multi-protocol communication.

By utilizing the xGM210x module, which has been pre-certified in Korea, North America, Europe, and Japan, developers can reduce research and development time related to RF design and protocol optimization, allowing them to focus on final application development.

The xGM210x module is designed to optimize performance in resource-constrained IoT products without compromising on features that affect communication reliability, product security, or field upgrade performance. The built-in RF power amplifier is also suitable for low-power Bluetooth applications requiring Line-Of-Sight (LoS) communication of several hundred meters.


A lineup optimized for LED bulbs
The initial product family of the Series 2 module portfolio includes the industry's first pre-certified wireless module optimized for LED bulbs, and versatile PCB form factor modules designed to meet a wide range of ultra-small IoT product design requirements.

The xGM210L module is designed to meet the unique performance, environmental, reliability, and cost requirements of smart LED lighting. Featuring a custom form factor that allows for easy mounting within LED bulb housings, this module offers a PCB trace antenna to maximize wireless range, a high operating temperature range, extensive global regulatory certifications, and low operating power consumption, providing the perfect wireless solution for cost-sensitive, large-scale production smart LED bulbs.

The xGM210P module simplifies space-constrained IoT designs, such as smart lighting, HVAC, and building and factory automation systems, with a PCB form factor, an embedded chip antenna, and minimal mechanical clearance.


IoT security of the xGM210x module
The xGM210x module supports RTSL (Root of Trust and Secure Loader) technology for secure boot, enabling developers to implement a high level of security in IoT products. This technology prevents malware implantation and rollbacks, ensuring authenticated firmware execution and over-the-air (OTA) updates.

The dedicated security core is isolated from the application processor and provides fast and energy-efficient encryption operation along with Differential Power Analysis (DPA) countermeasures.

A True Random Number Generator (TRNG) compliant with NIST SP800-90 and AIS-31 further strengthens the device's encryption.

The secure debug interface, which supports lock and unlock functions, allows only authorized connections for failure analysis.

The Arm Cortex-M33 cores in the xGM210x modules integrate TrustZone technology, ensuring system-level hardware isolation for a trusted software architecture.

Developers can accelerate time-to-market by using Silicon Labs' Simplicity Studio integrated development environment. Developers can optimize the wireless performance and energy consumption of IoT applications using network analyzers, energy profilers, and other tools.

Matt Saunders, Vice President of IoT Product Marketing and Applications at Silicon Labs, stated, “By leveraging the application-optimized xGM210x module portfolio, wireless communication for mesh networks can be implemented easily and quickly,” adding, “Silicon Labs supports customers in adding wireless communication and mesh capabilities to their IoT applications with minimal R&D costs, thereby reducing engineering and testing efforts by up to several months.”

The xGM210P module is currently available for both sample and mass production. Sample and mass production supply for the xGM210L module is scheduled for the fourth quarter of 2019. The Wireless Gecko Starter Kit mainboard and Series 2 Wireless board are also currently available for purchase. For pricing on Series 2 modules and development kits, please contact Silicon Labs regional sales offices or authorized distributors.
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