At 32k/2.5um resolution or 5Gpix per second
Reduce system costs with a maximum line rate of 150KHz
Enhanced detection capability through real-time upward image changes


One of the biggest challenges in the field of machine vision is increasing resolution while maintaining or reducing system-level costs.

Accordingly, Teledyne DALSA announced on the 21st that it has launched the 'Linea HS 32k TDI Camera,' a charge domain CMOS TDI camera utilizing pixel offset technology.

Linea HS 32k uses two 16k/5μm TDI arrays with pixel offsets. Two 16k/5μm images are captured in real time and then reconstructed to produce a high-resolution 32k/2.5μm image. Through this up-conversion, the detection capability of fine pixel defects is significantly improved.

Teledyne DALSA’s patent-pending pixel offset technology allows for the use of conventional lighting and 16k/5μm lenses while maintaining MTF and responsiveness with a small physical pixel size.

Using the new camera together with Teledyne's 'Xtium 2 CLHS high-performance frame grabber series' can significantly improve data throughput. The next-generation CLHS fiber interface provides reliable, high-throughput data transmission.

Fiber optic cables reduce costs, have a maximum cable length of 300m, and are unaffected by electromagnetic radiation in industrial environments. The Xtium 2 product family features a PCI Express Gen 3 x8 platform.