ACM Ultra Furnace Optimized for LPCVD Processes
Can also be used in oxidation, heat treatment, and atomic layer deposition processes


ACM Research unveiled the 'Ultra Furnace' for semiconductor dry process applications on the 11th.

The Ultra Furnace is optimized for low-pressure chemical vapor deposition (LPCVD) processes. With just a few changes to the components and layout, it can be applied to oxidation processes, annealing processes, and atomic layer deposition (ALD) processes.

Chemical vapor deposition is a process in which process gases react with each other at high temperatures to form a thin oxide or nitride layer on the surface of a silicon wafer. The ultra furnace is designed to enable batch processing of up to 100 12-inch (300 mm) wafers.

ACM will initially supply the Ultra Furnace to customers in China, and plans to expand to Korea and Taiwan later. Earlier this year, ACM supplied its first Ultra Furnace equipment to a fab of a major Chinese logic manufacturer.