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"Shortening the time to market for electronic products, 3D analysis tools are essential"

Google 우선 소스Published2021.03.12 15:15
Utilizing SW interpretation tools to shorten the time to market for electronic products
Dassault Systèmes supports analysis tools such as Abaqus and CST
Provides simplification options when interpreting 3D data



It is an era where video editing is possible with just a thin tablet. Edge devices are also equipped with AI functions that require high-performance processing. As the performance of electronic products has improved, the requirements for electronic products have also become more complex. On the other hand, due to fierce competition, release deadlines have become tighter.

The process of repeatedly making improved prototypes and identifying and correcting problems in products before launch is very effective in terms of verification, but it cannot avoid wasting time and resources. If you can identify problems in the product in advance, you can greatly reduce the process of making prototypes. For this purpose, there are various analysis tools on the market.

By converting the shape and properties of a product into 3D data and running it virtually through simulation, meaningful analysis data can be obtained. Simulations that are impossible in reality are also possible. Dassault Systèmes' 'Abaqus FEA' and 'CST Studio Suite' help engineers conduct structural and electromagnetic analyses virtually.

On March 35, at the 'e4ds EE Webinar', VENG CTO Park Jun and Dassault Systèmes CTO Park Jong-seon will present simulation methodologies based on Abaqus and CST and share insights on the topic of 'Application of 3 Major CAE (Computer-Aided Engineering) Technologies to Accelerate PCB Thermal Design Optimization'. e4ds News asked them about the benefits of using the tool and what support both companies offer.



VENG is a partner of Dassault Systèmes and specializes in the supply and support of the SIMULIA product line, a simulation tool brand of Dassault Systèmes.

CTO Park Jun served as the Korea branch manager of Abaqus and the brand manager of Dassault Systèmes Simulia, and is now in charge of overall technology at VENGE.




Q. It is said that it is important to minimize PCB warpage when manufacturing electronic products. What are the main causes of warpage?
A. It is due to the difference in thermal expansion coefficient between PCB composition materials. Since it is impossible to standardize PCB composition materials, it is impossible to eliminate warpage.


Q. How can I minimize warpage in the final PCB product?
A. Many PCB designs are made through repeated trial and error by experts who are familiar with differences in thermal expansion coefficients, chip placement, etc. However, if you can conduct virtual experiments through analysis before creating a design plan, and if you introduce nonlinear analysis that simultaneously considers heat, structure, and sometimes flow, you can greatly reduce these trial and errors.
▲ Thermal and EMI/EMC analysis for PCBs is possible
Abacus FEA [Image = Dassault Systèmes]

Q. VENGE supplies Dassault Systèmes’ Abaqus FEA as a tool for nonlinear analysis. What are the advantages of this tool over competing tools?
A. Abaqus was developed from the beginning to analyze nonlinear physical phenomena. If you use a tool that can analyze but cannot ensure reliability, the analysis may hinder your work. Abaqus is more accurate and reliable than any analysis tool on the market.


Q. What other analysis is possible with Abaqus other than PCB heat/EMI/EMC?
A.
PCB productization requires various analyses, including heat, EMI/EMC, etc. Abaqus can analyze fatigue due to vibration, creep due to heat, and stability of contact points due to impact. If you need other analyses, you can use tools such as CST.


Q. What support does VENGE provide to engineers who want to utilize Abacus?
A. VENGE provides technical support for software through professional engineers with extensive experience in the field. Additionally, we have experience solving various problems in the field through in-depth discussions with customers.



Dassault Systèmes, a software company headquartered in France, provides 3D CAD tools such as SIMULIA, CATiA, and SOLIDWORKS.

Jong-seon Bae, a technology representative in charge of industrial process consulting at Dassault Systèmes Korea, is currently sharing his simulation experience in the field, focusing on the CST Studio Suite.




Q. Dassault Systèmes' 'CST Studio Suite' is included in the Simulia portfolio along with Abacus. What are the differences between the two tools?
A. Although they are within the same brand, there is a big difference in the areas of interpretation. While Abaqus is a tool suitable for structural analysis, such as structure, vibration, and shock/collision, CST is suitable for areas related to electromagnetic fields. It is mainly used for RF system components such as antennas and filters, and EMI/EMC areas.
▲ Various electromagnetic field interpretations are possible
CST Studio Suite [Image = Dassault Systèmes]

Q. PCB configurations are becoming increasingly miniaturized and complex. Interpreting will require a lot of computing resources, are there any options to reduce this burden?
A. Computing resources are also improving. In particular, various solvers within CST can be computed using GPUs. When CPUs and GPUs are used together, the speed can be improved by nearly 10 times compared to solving with only CPUs, although this can vary depending on the GPU specifications and analysis model. When using multiple GPUs, the analysis speed is that much faster.

In addition, CST can proceed with analysis by applying various equivalent properties. If it is difficult to analyze the actual 3D structure, you can use equivalent properties.


Q. How accurate are the interpretation results?
A. Accuracy is usually compared to the measurement results, but it seems to vary depending on how similarly the measurement environment is described and interpreted. Such simulations should take into account the similarity of the 3D structure, material properties, and input signals.

The more accurately you can simulate and interpret real values, the more similar values you can obtain to the measured values. However, if you simulate the measurement environment as closely as possible, the analysis structure becomes more complex and larger, which can significantly increase the analysis time.

Depending on whether the goal is to match the interpretation to the measurements or to quickly see the trend of the results as the interpretation model changes, the interpretation settings will differ and the interpretation time will also differ significantly. Therefore, engineers must decide how to use the tool before the analysis.


Q. What are Dassault Systèmes’ future goals in the CAE field?
A. Dassault Systèmes is working to develop each simulation tool as well as create an environment where various tools necessary for business activities can be used in real time in a single virtual space called the '3DEXPERIENCE' platform.

Currently, many companies are going through a cumbersome process where analysis engineers request PCB data from the EDA data and 3D CAD management team for PCB analysis, receive it through a shared folder or email, and then import it into an analysis tool to conduct the analysis.

In this process, there are inconveniences such as receiving old data that has not been revised, or the time it takes to request and receive data is long. However, if all data is stored on a single platform and updated in real time, and such data can be downloaded and used immediately, more organic work will be possible.

And if the interpreted results are also stored on the platform and version control is possible, and if the results can be viewed by accessing the platform from anywhere rather than just on a PC, it becomes possible to conduct the interpretation work efficiently. Dassault Systèmes is striving to provide a work environment that maximizes work efficiency as well as the development of interpretation tools.
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WEBINAR종료
PCB 열 설계 최적화 작업 가속하는 3대 CAE 기술 응용 방안
  • 2021.03.25 10:30~12:00
  • ㈜브이이엔지 · 박준 CTO(브이이엔지) / 배종선 대표(다쏘시스템코리아)