Congatec has launched a module equipped with Intel 12th generation processors, improving key performance in embedded and edge computing systems through a dramatic increase in the number of cores.

Congatec Korea announced on the 5th that it has launched 10 types of COM-HPC and COM Express Computer on Module (COM) equipped with 12th generation Intel Core mobile and desktop processors (codename Alder Lake).

New COM-HPC size A and C modules and COM Express type 6 form factor based on Intel's latest high-performance cores provide major performance enhancements and improvements in embedded and edge computing systems, enabling engineers to leverage Intel's high-performance hybrid architecture.

The 12th generation Intel Core processors provide up to 14 cores and 20 threads in BGA models and 16 cores and 24 threads in LGA-based desktop versions, dramatically advancing multitasking and scalability levels for next-generation IoT and edge applications.

In addition, it is possible to scale multi-threaded applications and execute background tasks more efficiently based on support for up to 6 or 8 (BGA/LGA) optimized high-performance cores (P-cores), up to 8 low-power efficiency cores (E-cores), and DDR5 memory.

with up to 96 execution units (EUs) of the integrated Intel Iris Xe GPU Mobile BGA processors provide an immersive user experience with up to 129% improved graphics performance compared to 11th generation Intel Core processors and can also process parallel processing workloads such as artificial intelligence (AI) algorithms faster.

The graphics of the LGA processor-based module, optimized for the best embedded client performance, provide up to 94% faster performance, and image classification inference performance has improved nearly threefold with up to 181% throughput.

In addition, this module provides vast bandwidth to connect individual GPUs for maximum graphics and GPGPU-based AI performance.

In addition to PCIe 4.0, the processor is equipped with ultra-high-speed PCIe 5.0 interface technology, allowing peripheral devices to benefit from lane speeds that are twice as fast as those of the BGA version.

In addition, the desktop chipset provides up to 8 PCIe 3.0 lanes for additional connections, while the mobile BGA version provides up to 16 PCIe 4.0 lanes from the CPU and up to 8 PCIe 3.0 lanes from the chipset.