congatec Korea, a leader in embedded and edge computing technologies, has launched a server module featuring the Intel Xeon processor D family, supporting next-generation real-time microserver workloads in harsh environments and extreme temperatures.

Congatec recently announced the launch of its Size E and D Server-on-Modules and the x86-based COM-HPC server module Com Express Type 7, in conjunction with the launch of Intel's latest Xeon processor D family (Ice Lake D).

This enables congatec to support next-generation real-time microserver workloads in harsh environments and extreme temperature conditions.

It supports up to 20 CPU cores, RAM speeds of 3,200 MT/s, and capacity of up to 1 TB, which is a four-fold increase over existing products, and the throughput per PCIe lane is doubled to GEN4 speed, supporting communication of up to 100 GbE and TCC/TSN.

The new modules range from industrial workload integration servers for factory automation, robotics, and medical imaging to outdoor servers for smart grids for oil, gas, and electricity, and public facilities and critical infrastructure such as railways and telecommunications. Of course, it can be utilized in vision-based applications such as autonomous vehicles and video infrastructure for safety and security.

“The launch of our Intel Xeon D processor-based COM-HPC Server-on-Modules for accelerating high-volume workloads represents a significant milestone for the edge server industry in three respects,” says Martin Danzer, Director Product Management at congatec. “First, the Intel Xeon D processor-based Server-on-Modules support an extended temperature range, enabling them to be used in general industrial environments as well as outdoor and automotive applications. Second, the COM-HPC Server-on-Modules offer an industry-first increase in the number of available cores to 20 and significantly increase memory bandwidth with up to eight RAM sockets, addressing key server workload requirements. Third, the new server modules offer real-time processing capabilities for both the processor cores and TCC/TSN-based real-time Ethernet. This combination of features is exactly what many OEMs have been asking for.”