FlightSense Device Sales Surpass 2 Billion Units… Establishing a Leading Position in the dToF Field
Announcement of integrated dToF lidar module supporting up to 2.3k zones for AR/VR applications

With over 2 billion sensors shipped to the market, STMicroelectronics continues to expand its unrivaled portfolio, encompassing everything from the simplest single-zone devices to the latest high-resolution 3D iToF and dToF sensors.

STMicroelectronics today announced the industry’s first integrated 2.3k-resolution direct Time-of-Flight (dToF) 3D LiDAR module and announced that the world’s smallest 500k-pixel indirect Time-of-Flight (iToF) sensor is already being adopted into customer designs.

“ToF sensors’ ability to accurately measure distances to target objects is enabling new capabilities in smart devices, consumer electronics, and industrial automation,” said Alexandre Balmefrezol, General Manager of ST’s Imaging Subgroup. “With our multi-regional in-house high-volume module assembly facilities, pixel and metasurface lens technology, and a vertically integrated supply chain that covers design through manufacturing, ST is able to deliver highly integrated, high-performance, innovative sensors.”

The new dToF 3D LiDAR device, the VL53L9, It has a resolution of up to 2.3k zone.

It is the only camera on the market to feature built-in dual-scan floodlights to detect small objects and edges, and can capture both 2D infrared (IR) images and 3D depth map information.

It is delivered as a ready-to-use, low-power module with on-chip dToF processing, so there is no need for additional external components or calibration. It also provides state-of-the-art distance measurement performance from 5 cm to 10 m.

The VL53L9, with its versatile features, enhances camera support performance to enable telephoto photography.

It supports features such as laser autofocus, bokeh, and cinema effects for stills and video at 60fps (Frames per Second).

In virtual reality (VR) systems, accurate depth and 2D images can be used to improve spatial mapping, enabling more immersive gaming and VR experiences such as virtual visits and 3D avatars.

Additionally, this sensor can detect the edges of small objects at short and long ranges, making it suitable for applications such as virtual reality and SLAM (Simultaneous Localization and Mapping).

ST also announced the start of mass production of the VD55H1 ToF sensor, and announced early adoption in designs by Lanxin Technology, which focuses on mobile robot depth-vision systems.

MRDVS, a subsidiary of Lanxin, adopted the VD55H1 to add high-precision depth sensing capabilities to its 3D cameras.

Equipped with ST sensors, this high-performance, ultra-compact camera combines 3D vision and edge AI capabilities to support intelligent obstacle avoidance and high-precision docking capabilities for mobile robots.

In addition to machine vision, the VD55H1 is also ideal for 3D webcams and PC applications, 3D reconstruction for VR headsets, people counting and activity detection in smart homes and buildings.

The product embeds 672 x 804 sensing pixels into a small chip and accurately maps three-dimensional surfaces while measuring distances to over 500,000 points.p;

Leveraging ST’s stacked wafer manufacturing process, this backside-illuminated product delivers superior resolution with a smaller die size and lower power consumption than other commercially available iToF sensors.

These characteristics make it an excellent sensor for creating 3D content that supports webcam and virtual reality applications such as virtual avatars, hand modeling, and gaming.

First samples of the VL53L9 are already available to key customers, with volume production scheduled for early 2025. The VD55H1 is currently in full production.

Pricing information and sample requests can be obtained from your local ST representative. ST will showcase various ToF sensors and technologies, including the VL53L9, at the Mobile World Congress 2024 exhibition (Booth 7A61) held in Barcelona, Spain from February 26 to 29.