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Meets memory bandwidth requirements for machine learning, big data analysis, etc.
Altera announced that it is offering a heterogeneous system-in-package (SiP) device integrating SK Hynix's stacked High-Bandwidth Memory (HBM2) with its own high-performance Stratix® 10 FPGA and SoC. The Stratix 10 DRAM SiP is expected to provide a new device that meets the demanding memory bandwidth requirements of high-performance systems.
The Stratix 10 DRAM SiP will provide more than 10 times the memory bandwidth compared to current discrete DRAM solutions. By providing a high level of bandwidth, it is now possible to meet the demands required to process the ever-increasing volume of data in data centers, broadcast, wired networking, and high-performance computing systems.
Altera has combined innovative 3D stacked memory technology with FPGAs for the first time in the industry. By using the Stratix 10 DRAM SiP, users can not only customize their workloads but also achieve maximum memory bandwidth in a highly power-efficient manner. Altera is discussing the adoption of these DRAM SiP products in next-generation high-end systems with more than a dozen customers.

Uses high-performance, high-density silicon bridges, enabling single-package connection
Altera's heterogeneous SiP products were made possible by using Intel's EMIB (Embedded Multi-Die Interconnect Bridge) technology, which enables the connection of multiple dies into a single package using a small, high-performance, high-density silicon bridge. Because the traces between the dies are very short, EMIB technology allows for the more economical implementation of heterogeneous SiP devices that provide high performance and higher throughput at lower power consumption compared to interposer-based solutions.
Danny Biran, Senior Vice President of Strategy and Marketing at Altera, said, “Today, there is an increasing demand for higher memory bandwidth as we implement computationally intensive tasks such as machine learning, big data analytics, image recognition, workload acceleration, and 8K video processing. By integrating the industry’s highest-performing FPGAs and high-bandwidth memory into a single package, Altera is able to meet these system requirements ahead of anyone else. No other programmable solution will be able to match the Stratix 10 DRAM SiP in terms of performance, power efficiency, and memory bandwidth.”
Altera announced that it is offering a heterogeneous system-in-package (SiP) device integrating SK Hynix's stacked High-Bandwidth Memory (HBM2) with its own high-performance Stratix® 10 FPGA and SoC. The Stratix 10 DRAM SiP is expected to provide a new device that meets the demanding memory bandwidth requirements of high-performance systems.
The Stratix 10 DRAM SiP will provide more than 10 times the memory bandwidth compared to current discrete DRAM solutions. By providing a high level of bandwidth, it is now possible to meet the demands required to process the ever-increasing volume of data in data centers, broadcast, wired networking, and high-performance computing systems.
Altera has combined innovative 3D stacked memory technology with FPGAs for the first time in the industry. By using the Stratix 10 DRAM SiP, users can not only customize their workloads but also achieve maximum memory bandwidth in a highly power-efficient manner. Altera is discussing the adoption of these DRAM SiP products in next-generation high-end systems with more than a dozen customers.
Uses high-performance, high-density silicon bridges, enabling single-package connection
Altera's heterogeneous SiP products were made possible by using Intel's EMIB (Embedded Multi-Die Interconnect Bridge) technology, which enables the connection of multiple dies into a single package using a small, high-performance, high-density silicon bridge. Because the traces between the dies are very short, EMIB technology allows for the more economical implementation of heterogeneous SiP devices that provide high performance and higher throughput at lower power consumption compared to interposer-based solutions.
Danny Biran, Senior Vice President of Strategy and Marketing at Altera, said, “Today, there is an increasing demand for higher memory bandwidth as we implement computationally intensive tasks such as machine learning, big data analytics, image recognition, workload acceleration, and 8K video processing. By integrating the industry’s highest-performing FPGAs and high-bandwidth memory into a single package, Altera is able to meet these system requirements ahead of anyone else. No other programmable solution will be able to match the Stratix 10 DRAM SiP in terms of performance, power efficiency, and memory bandwidth.”
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