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KLA-Tencor Launches Comprehensive Wafer Inspection and Review Product Family

Google 우선 소스Published2016.07.12 10:06
Solving 10nm Yield Challenges with Advanced Defect Detection and Process Monitoring

Ahead of SEMICON West, KLA-Tencor Corporation introduced the following six advanced wafer defect inspection and review systems for the manufacturing of advanced IC devices.

This includes the D30 (formerly called Gen 5) and D7 broadband plasma optical inspectors, Puma™ 6 laser scanning inspectors, CIRCL™5 all-surface inspection clusters, Surfscan SP5XP non-pattern wafer inspectors, and eDR7280 electron beam review and sorting equipment.

These systems employ various types of innovative technologies to implement comprehensive wafer inspection solutions, making it possible to detect and manage defects that have a significant impact on yield at every stage of IC manufacturing, from initial process characterization to production process monitoring.



Mike Kirk, Senior Vice President of KLA-Tencor’s Wafer Inspection business unit, said, “Through early collaboration with customers, we were able to gain a clearer understanding of inspection requirements for future process nodes. As a result, we were able to direct our R&D and engineering efforts to provide inspection systems and solutions that help customers resolve critical yield issues.”

In addition, “As an example, the D30 broadband plasma inspector not only provides impressive inspection performance (optical detection of sub-10nm defects) but also supports process debugging even for the most complex device designs.” “All systems included in our new wafer inspection product family combine innovative technologies that support advanced defect detection and monitoring, enabling customers to develop and secure state-of-the-art devices,” the company stated.
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