2017 marks the 50th anniversary of showcasing innovative products that inspire developers at CES.

Autonomous vehicles, next-generation displays, and connectivity available anywhere are no longer dreams. Texas Instruments (TI) is making these dreams a reality and helping technology be realized in the future.

This year is no exception. TI announced that developers will be able to encounter the latest semiconductor technology and system-level expertise in automotive and consumer electronics sectors. In response, it has presented the Top 3 items that must be checked at the exhibition.

1. Evolution of Display Technology

How will displays in automotive and consumer electronics evolve? At this CES, Kent Novak, Senior Vice President and General Manager of DLP® Products, will present on the future of MEMS-based displays. He will address the current state of the display market, the need for more colorful, crisp, and brighter displays, and methods to solve these requirements in finished products ranging from wearables to vehicle head-up displays (HUD) (January 5, 9-10 AM local time, Venetian Hotel, MEMS and Sensors Industry Group Conference Track)

The Internet of Things (IoT) industry is projected to reach trillions of dollars in scale. Connected devices are appearing in the market at an incredibly rapid pace. Developers, manufacturers, and innovators will gather to discuss future IoT trends, consumer requirements, and expectations. Mattias Lange, Product Line Manager of TI's wireless connectivity solutions, will participate as a panelist. (January 7, 9-10 AM, Las Vegas Convention Center (N256))

2. Future Automotive Technology Becomes Reality

As consumer requirements increase, ADAS (Advanced Driver Assistance Systems) is evolving into surround-view, camera mirror systems, driver monitoring applications, and more. You can see how TI's TDA processor product line meets these future development requirements.

Head-up display (HUD) technology improves driver visibility by displaying information with a wide field of view regardless of weather, temperature, or polarization conditions. You can experience how augmented reality using DLP® technology helps drivers and manufacturers.

Immersive audio quality is essential not only for a rich in-cabin audio experience but also for driver alerts and telematics applications. TI's audio products deliver dynamic quality in automotive applications as well as home entertainment and personal electronics without consuming much space or power.

3. Cloud Connectivity

TI's USB Type-C and Power Delivery 3.0 controller won the 2017 CES Innovation Award and is the industry's smallest single connector for exchanging power and data in personal electronics.

Cloud connectivity is increasing, and developers continue to find new ways to connect consumers to the cloud. TI will showcase technology that makes it easier for developers to design cloud sensing applications for home and building automation and factory automation applications.

Both low power and connectivity are important. From 3D ToF (time-of-flight) functionality for robotics and building automation to energy harvesting that extends drone flight time and innovative battery management, TI will showcase technology that enables connectivity with the minimum possible power.

Tip ! Can't attend CES? During the event, you can access TI's Facebook Live to watch customers and TI experts discuss the future of displays, realizable connected life, and future automotive technology.