If you are curious about the state of technology, from automotive electrical components to quality control,
The Korea Industrial Technology Association held a seminar on "Automotive Electrical Components Technology Development Trends."
A variety of information, including application cases, will be introduced at the association's Seoul training center on February 24th.
Electronic components are emerging as a key component in the automotive industry. They account for over 40% of automotive manufacturing costs, and in electric vehicles, their share reaches 70%. Semiconductor use is increasing, to the point where they're being called "running semiconductors." The future automotive market is projected to reach $80 billion by 2020, growing at an average annual rate of 8%.
A forum for understanding the current state of the automotive electronics industry is opening. The Korea Industrial Technology Association ( http://www.kitanet.or.kr ) will provide information on "Automotive Electronics Technology Development Trends and Application Cases in the Fourth Industrial Revolution" to automotive electronics companies at its Seoul Training Center on the 24th.
Dr. Jeon Hwang-su of the Electronics and Telecommunications Research Institute will present on ‘Recent Industry Status of Automotive Electrical Components, Domestic and International Market Size, Status of Related Companies, Technology Development Trends, and Application Cases’, introducing the following: △Industrial Status of Automotive Electrical Components, △Domestic and International Market Outlook, △Status of Related Companies and Technology Development Trends.
Next, Dr. Min Kyung-won of the Electronics and Telecommunications Research Institute will present on ‘Sensor/Component Convergence Technology Development Trends and Application Cases for Smart Car Implementation’, covering: △ Smart Car Technology Trends △ Current Status of Development of Automotive Camera/Radar and LiDAR Sensors △ Requirements and Development Status of System Semiconductors for Smart Cars. Lim Heon-chang, Manager of SP Semiconductor Communications Co., Ltd., who focuses on power semiconductor packaging, will discuss the bonding of power semiconductor elements, the bonding of power semiconductor terminals, and power semiconductor module packaging materials.
From improving the quality of battlefield components to safety and reliability
The afternoon session will focus on improving the quality of electrical components and ensuring their safety and reliability. Heo Seon-hoe, CEO of Polyog, will present "Trends in PCB Analysis and Automation Technology Development and Application Cases for Improving Automotive Electrical Circuit Quality."
Through the development trends and application cases of automotive electrical components and EMC technology, Song Tae-seung, head of the Korea Testing Laboratory, examines EMC countermeasure techniques and the future outlook for international EMC standards.
Team Leader Lee Hyuk-ki of the Korea Automotive Technology Institute will introduce international standards for automotive functional safety and present trends in the development of functional safety technology for future automotive electrical components and application cases, taking into account the current domestic and international situation and the situation in each field.
Oh Mi-hye, director of the Korea Automotive Technology Institute (KATI), will present the company's efforts to improve the quality of electrical components. The presentation will highlight trends in materials technology for automotive electrical components, manufacturing and performance enhancement of functional materials, and evaluation of materials and components for automotive application. The presentation will provide insight into the progress of materials development.
Dr. Hyung-Tae Kim's presentation from APRO Co., Ltd. addresses the environmental reliability of lead-free solder in automotive electronics. Through 'Trends in the development of technology for reliability evaluation of automotive electrical components and application cases,' we plan to present in detail the following: △Reliability trends for lead-free solder in automotive electrical components, △Environmental reliability testing for lead-free solder, and △Post-test evaluation methods for lead-free solder.
Seminar registration schedule and procedures can be found at the Korea Industrial Technology Association ( http://www.kitanet.or.kr ).
















