Reduces PCB Assembly Area and Provides Security Features

STMicroelectronics has launched NFC devices for contactless payment and data exchange. These include the ST21NFCD NFC controller and two ST54 System-in-Package (SiP) products.



The ST21NFCD chip features active load modulation capability. It supports card emulation, read/write, and P2P communication modes, and includes an eFlash area. The chip supports NFC Forum's NCI 2.0 specification. It also complies with NFC Forum Type 1-5 tag standards, ISO/IEC 18092 NFC Interface/Protocol (NFCIP), as well as payment standards including the latest EMVCo version.

The ST21NFCD chip features ultra-high sensitivity RF performance support, enabling the use of miniaturized antennas and providing the capability to use external clock sources instead of crystals. It also allows selective use of DC/DC boosters through high output power. These characteristics help reduce the number of required components and PCB assembly area.

ST's latest ST54 System-in-Package (ST54F and ST54H) includes the ST21NFCD NFC controller and an embedded security element. The eSE is an ST33 security microcontroller certified to the highest security standards such as CC EAL5+ and EMVCo for financial services, providing an integrated device that is simple and user-friendly while offering protection against counterfeiting and hacking. Using a proven ARM SecurCore SC300 core, it supports Java Card and GlobalPlatform through a secure OS.

The ST54F includes the ST21NFCD and ST33G1M2 security element, providing eFlash area up to 1.28 MB. The ST54H features the enhanced ST33J2M0, providing eFlash area up to 2 MB with twice the performance of the ST33G1M2, enabling connectivity with digital security applications provided by service operators.

The ST21NFCD and new ST54 SiP are currently in mass production and are available in a 4mm x 4mm x 0.8mm 64-pin WFBGA package.