Sudhere Sharma explains smart connected product development and quality improvement methods

ANSYS Korea hosted the 2017 ANSYS Electronics Simulation EXPO (AESE), which covered methods for improving the design of electronic systems and the latest technologies and case studies by industry sector.

Held at the COEX Grand Ballroom, the expo opened with a keynote speech by Sudhir Sharma, Marketing Director for High-Tech Industries at Ansys, in the presence of Ansys' clients and experts from various fields. For approximately 50 minutes, Sharma explained methods for developing and improving the quality of smart connected products through engineering simulation.

Following this, Taejin Kim, a manager at Ansys Korea, gave a presentation on simulation case studies utilizing artificial intelligence and machine learning, which are currently receiving significant attention, as well as future prospects. He said, “Technological advancements have made it possible to realize functions similar to human learning ability in computers,” adding, “Therefore, computers can learn the causes of past failures on their own and recognize problems before errors occur, enabling them to derive more accurate simulation values and reduce maintenance costs.”

In addition, speeches were given by experts from Ansys Korea and industry experts from client companies Samsung, SK Hynix, and NI Korea on the two topics of IC Power & Reliability and HF (High Frequency)/SI (Signal Integrity).

In the first track, under the theme of IC Power & Reliability, presentations were given by customer and in-house experts on semiconductor design, including EM sign-off of FinFET signals to assist in System-on-Chip (SoC) design and the utilization of Ansys' PowerArtist for the mass production of semiconductor chips, as well as on Ansys' semiconductor product family solutions, with the portfolio further strengthened through its subsidiary, Apache Design.

In the other topic, the HF (High Frequency)/SI (Signal Integrity) track, various analysis methods and examples of Ansys electromagnetic simulation were introduced to support the design and verification of antennas, RF, and microwave components, including coupled analysis methods in the thermal-electronics field using Icepak in the Electronic Desktop environment and solutions for designing mmWave antennas for ADAS and 5G.

Ansys Korea CEO Yong-Won Cho stated, “The electronic effects on the circuits and systems of recently developed high-performance electronic products and advanced current devices"The influence of electromagnetic fields is growing," he said. "Our electromagnetic field simulation can evaluate additional factors such as temperature and vibration in addition to electromagnetic performance, enabling optimal design for advanced communication systems and high-performance electrical and electronic systems."