Maximizing system stability, integration, security, and availability

ANSYS announced the release of 'ANSYS 19,' which dramatically reduces the cost and time to market for innovative products ranging from autonomous vehicles to smart devices.

Ansys 19 helps resolve design complexity and address these challenges by supporting tools that improve reliability, performance, speed, and ease of use for all engineers across industries. It also enhances engineer productivity by providing solutions that create a seamless workflow at every stage.

Ansys 19 has completed updates aligned with the latest industry trends across product families, including embedded software, fluid, structural, and electrical/electronic. In the embedded product family, Ansys 19 supports Architecture Analysis and Design Language (AADL)-based modeling. This helps enterprises control system costs and maximize critical performance metrics such as system reliability, integration, security, and availability.

Ansys 19, capable of modeling software and hardware components, provides tools to support the design of electronic device systems for military applications compliant with the U.S. aerospace technology standard, FACE (Future Airborne Capability Environment). In addition, Ansys 19 enables engineers to design and implement state-of-the-art embedded HMIs (Human Machine Interfaces). This enables engineers to rapidly develop, deploy, and test safety-critical HMIs, ranging from the control of aircraft cockpit displays to automotive infotainment and dashboard displays, and room displays for industrial applications.

In addition, Ansys 19 provides a solution for Multirate (Multi-scheduled Multi-threaded application on Multi-core processors) applications commonly used in embedded software. These applications faced several challenges in processing data between functions scheduled at different speeds. With the newly provided solution, users can receive a seamless flow to identify and verify Multirate application architectures within qualified code, thereby significantly reducing the time required for certification and qualification.

The Mechanical and Electromagnetics product family has introduced Radar Cross Section (RCS) analysis using HFSS SBR+. Useful for engineers designing autonomous vehicles, advanced detection systems, and stealth technologies, this technology optimizes numerous designs by digitally iterating and exploring them in a short period of time. Additionally, Ansys 19 provides a robust and integrated 'Electromagnetic-Thermal Coupled Analysis' workflow that predicts the thermal effects critical to the development of high-performance electronics. In addition, it provides enhanced computing power and additional capacity through high-performance computing (HPC) cores increased from the existing two to four.

ANSYS Medina Analyze, a new system product family, can be used for functional safety analysis in the automotive, aerospace and defense, rail, nuclear, and other safety-critical industries. By implementing a step-by-step modeling, analysis, and verification process that aligns with applicable safety standards, it simplifies and automates the analysis of failure modes and their scope through safety mechanisms across a wide range of operational scenarios.

In the semiconductor field, Ansys 19 provides a comprehensive simulation solution that simultaneously addresses various design characteristics, such as power noise, thermal characteristics, reliability, and performance, across the entire spectrum of chip package systems. Furthermore, Ansys 19's big data simulation platform enables rapid design iteration under various operating conditions and prioritizes design modifications through analysis, thereby significantly reducing time-to-market.

New features in the upgraded fluid product family significantly reduce the computational effort required by spray nozzle designers to optimize product performance. Unlike previous methods that calculated droplet distribution sizes, Ansys 19 directly tracks interfacial instability and surface tension effects that cause ligament and droplet formation based on the fluid model's capacity. This enables fast and accurate spray fragmentation resolution and droplet ejection.

In the structural product family, Ansys 19 provides enhanced speed and remeshing automation with groundbreaking updates to the remeshing methods for disintegration, deformation, adaptation, and disintegration. The industry's first Material Force Fracture Parameter helps users gain insights that go beyond the assumptions of typical linear elastic fracture mechanics. Thus, engineers can overcome non-linear problems in applications such as sealing and forming materials using Ansys 19's non-linear adaptivity capabilities.

The 3-D design product family provides engineers of all levels with the opportunity to use simulation as a new approach when designing products. Engineers using Ansys 19 can produce lighter and more robust designs in a short timeframe through enhanced topology optimization capabilities. Furthermore, Ansys continuously provides geometry optimization updates to allow engineers to gain additional control over the final design in a short period. In addition, improvements in printing capabilities enable engineers to modify and control topology-optimized geometries more quickly and flexibly for downstream use.

"Many companies are shortening product design cycles by 30–50% and drastically reducing testing costs by shifting prototyping tasks from hardware to software using the outstanding design optimization capabilities of Ansys simulation software," said Yongwon Cho, CEO of Ansys Korea. "Through the enhanced pervasive engineering simulation solutions of the newly introduced Ansys 19, Ansys will provide engineers in various fields with the insights to effectively solve the complex problems they face."