Designed with a vertical fastening structure that minimizes PCB occupancy area

Molex Korea has launched the Pico-EZmate Slim 1.20mm pitch wire-to-board connector, a compact design that improves both reliability and assembly time.

“As consumer electronics devices continue to become smaller, manufacturers are looking for ways to reduce the overall size of their products without compromising reliability or manufacturing flexibility,” said Rick Lee, global product manager at Molex. He emphasized that this ultra-miniature connector, with a pitch and product height of just 1.20mm, is designed with a vertical mating structure that minimizes PCB footprint, making it an ideal solution for compact devices in a small, powerful package.

The vertical mating structure of the Pico-EZmate Slim 1.2mm pitch wire-to-board connector eliminates the possibility of improper connection, enabling fast and reliable assembly. The mis-insertion prevention key further enhances reliability by preventing incorrect plug mating.

Suitable for mobile phones, tablets, and other ultra-small entertainment devices where space within the device must be maintained with maximum production efficiency, the Pico-EZmate Slim 1.20mm pitch wire-to-board connector significantly reduces the overall PCB footprint within the device compared to other connectors.