High-Speed 12-Megapixel and 4K UHD Devices for Industrial Camera Design

ON Semiconductor has unveiled an X-Class image sensor platform that supports multiple pixel functions in a single camera design. The first devices included in this platform are the 12-megapixel (MP) XGS 12000 and 4K UHD resolution XGS 8000 image sensors, which deliver high-performance imaging capabilities for applications such as machine vision, intelligent transportation systems, and broadcast imaging.

The X-Class image sensor platform supports various CMOS pixel architectures within the same image sensor frame. With a single camera design, it supports diverse product resolutions and enables larger pixels that trade resolution for higher imaging sensitivity in a given optical format, as well as designs optimized for noise reduction to increase tolerance. Camera manufacturers can leverage existing component inventory by supporting various pixel architectures through common high-bandwidth, low-power interfaces, and can accelerate the time-to-market for new camera designs.



The XGS 12000 and XGS 8000, the first devices in the X-Class product family, are characterized by outstanding imaging performance, uniformity, and low noise. These products are based on the platform's first pixel architecture, including advanced 3.2 micrometer (µm) global shutter CMOS pixels. The XGS 12000 delivers 12MP (4096 x 3072 pixels) resolution in a 1-inch optical format, providing the image requirements and performance needed for the latest machine vision and inspection applications.

It is offered in two versions: a version that delivers maximum resolution at 90 frames per second, fully utilizing the 10-gigabit Ethernet interface, and a cost-effective version that delivers a maximum frame rate of 27 frames per second adapted to the bandwidth available in USB 3.0 computer interfaces. The XGS 8000 offers 4K UHD (4096 x 2160 pixels) resolution in a 1.1-inch optical format. Two versions supporting frame rates of 130 and 72 frames per second will be released, making it suitable for broadcast applications.

Both devices feature compact 29 x 29 mm² package sizes with low thermal characteristics implemented through the X-Class interface's low-voltage, low-power architecture, compatible with compact camera designs.

Hubert Uehard, Vice President and General Manager of the Industrial Solutions Business Unit for ON Semiconductor's Image Sensor Group, stated, "Through the X-Class platform and new XGS pixel-based devices, end-users can leverage the performance and imaging capabilities their applications require. Camera manufacturers gain the flexibility needed to develop next-generation camera designs for both current and future customers."

The XGS 12000 and XGS 8000 will begin sampling in Q2 2018 and move to production in Q3. Both devices will be packaged in 163-pin LGA (Land Grid Array) packages in monochrome and color versions. In the future, devices based on the 3.2-micrometer (µm) XGS pixels and products based on other pixel architectures will be added to the X-Class product family.