The average annual growth rate is projected to reach 14%.

UnitySC announced that it has acquired 100% of the shares of HSEB (HSEB Dresden, GmbH), a German company leading in optical inspection, review, and metrology solutions for high-value semiconductor applications. The merged company plans to provide essential inspection and metrology capabilities to semiconductor manufacturers through an expanded portfolio of state-of-the-art process control solutions. The semiconductor manufacturing sectors covered by the combined portfolio will expand to include substrates, front-end-of-line (FEOL) manufacturing, wafer-level packaging (WLP), 3D ICs, and power semiconductors, and global customer support for all platforms offered by the merged company is also expected to be strengthened.

UnitySC and HSEB's integrated product portfolio and common platform are set to support the manufacturing of devices used in mobile, automotive, and Internet of Things (IoT) applications. The combined compound annual growth rate of these markets is expected to reach 14%, which far exceeds the overall semiconductor industry growth rate of 8%. To support this growth, the expansion and construction of new manufacturing facilities equipped with new equipment lines will likely be necessary.

Patrick Lüterchtre, President of UnitySC, said, “Our product portfolio has now expanded to include areas required for advanced packaging such as fan-out WLP, embedded dies, and through silicon vias (TSVs), as well as new FEOL substrate control, enabling us to enter high-value markets where greater growth is expected in the future.”