Solder-Free Press-Fit Connection Instead of Soldering Pins

STMicroelectronics (ST) has launched a new ACEPACK (Adaptable Compact Easier PACKage) module that delivers cost-effective high-density power conversion.

The module is suitable for 3 to 30KW applications including industrial motor drives, air conditioning, photovoltaic generators, welders, battery chargers, UPS controllers, and electric vehicles.

ST's space-efficient low-profile ACEPACK technology combines high power density and reliability in an economical plastic package. The technology simplifies assembly by employing an optional solder-free press-fit connection method instead of conventional soldering pins, and provides metal screw clamps for fast and reliable mounting.

ST's third-generation Field-Stop Trench IGBT delivers an optimal combination of low on-resistance and high switching performance. Two configurations are optionally available: a 6-pack module containing six IGBTs with Freewheel diodes in a three-phase inverter, or a PIM (Power Integrated Module) providing a complete driver power stage. The PIM is a CIB (Converter-Inverter-Brake) device that integrates a three-phase rectifier, three-phase inverter, and a braking chopper that handles energy returned from the load. Both types include NTC thermistors for temperature sensing and control.

Various PIM/CIB and 6-pack devices are available in ACEPACK 1 size with 650V or 1200V IGBT, and in the larger ACEPACK 2 size, with rated currents ranging from 15A to 75A. The internal layout of this module is optimized for low parasitic inductance and low EMI emission, making it easy to meet EMC regulations, and 2.5kV isolation ensures reliable performance even under harsh operating conditions. Since all modules support a maximum operating temperature of 175°C, designers have greater flexibility in optimizing heatsink size and power consumption.