TI Unveils Three Solutions Including Ultra-High-Speed ADC for AI Data Centers
Texas Instruments (TI) has unveiled three semiconductor solutions to address power instability and downtime issues in AI data centers: an ultra-high-s…
2026.10.13 by 배종인 기자
AI-Driven Transformation of Power Semiconductor Landscape: Shift of Focus from Electric Vehicles to Data Centers
Power semiconductor demand is rapidly shifting from electric vehicle-centric applications to AI data centers and AI servers. With rising power consump…
2026.10.06 by 배종인 기자
SK Hynix "No Confirmed Matters Related to Solidigm"
SK Hynix stated that there are currently no confirmed matters regarding capital utilization plans related to Solidigm, and all decisions will be made …
2026.10.01 by 배종인 기자
Samsung Six Affiliates Invest $1 Billion in U.S. AI Infrastructure Company Helix
Six Samsung affiliates, including Samsung Electronics, are jointly investing a total of $1 billion in Helix, a U.S. AI infrastructure company. Samsung…
2026.09.29 by 명세환 기자
Samsung Electronics Breaks Ground on Flakt Group HVAC Production Line in Gwangju
Samsung Electronics has broken ground on an HVAC production line at its Gwangju facility in partnership with Flakt Group, with an investment of 240 bi…
2026.09.21 by 명세환 기자
LG Electronics Launches Air-Cooled Turbo Chiller for AI Data Centers
LG Electronics has launched an air-cooled turbo chiller dedicated exclusively to AI data centers. By applying oil-free magnetic bearings and refrigera…
2026.09.21 by 명세환 기자
Lattice, "Precisely Targeting Next-Generation Infrastructure Security and Development Productivity Innovation"…Quantum-Secure FPGA and Generative AI Design Tool Simultaneously Unveiled
As security enhancement in preparation for the quantum computing era and AI-based design automation have emerged as critical challenges for the semico…
2026.09.17 by 배종인 기자
Samsung Electronics Unveils Energy Solutions at International Climate Industry Expo
Samsung Electronics unveiled an integrated energy-saving solution at the 2026 International Climate Industry Expo. The company integrated cooling, hea…
2026.09.16 by 배종인 기자
[e4ds Tech Day 2026 ③] Matteo Maravita, ST Center Director: "Generative AI is Also Moving to the Edge"
STMicroelectronics highlighted the surging data center power issues due to generative AI proliferation at e4ds Tech Day 2026, emphasizing that the key…
2026.09.15 by 배종인 기자
Facing High-Current Power Supply Design Limits, 'GaN Integration' Solution Rapidly Emerging
GaN-based integrated power conversion technology is emerging as a key solution, replacing silicon limitations in high-current environments such as AI …
2026.09.15 by 배종인 기자
EVG Supports Resolution of CPO Manufacturing Challenges for AI Data Centers
As the importance of CPO (Co-Packaged Optics), a high-bandwidth and low-power optical interconnect technology, grows with expanding AI data center dem…
2026.09.02 by 배종인 기자
Applied Materials Targets 'Memory Wall' in AI Era...Presents Solutions Across D-RAM, HBM, and Packaging
In the artificial intelligence (AI) era, semiconductor industry competition hinges on 'data movement' rather than 'computation'. As AI models grow lar…
2026.08.31 by 배종인 기자
Gartner "Memory Sales to Reach $837.3 Billion in 2026… 280% Year-over-Year Surge"
Gartner forecasts that the global semiconductor market will reach $1.5552 trillion in 2026. Expansion of AI infrastructure investment and memory price…
2026.08.25 by 명세환 기자
SK Hynix Unveils Next-Generation AI Infrastructure Blueprint Based on Optical Interconnect
SK Hynix has disclosed its CPO (Co-Packaged Optics) roadmap, a core technology for next-generation AI infrastructure, to Nature Electronics. To addres…
2026.08.21 by 배종인 기자
Samsung Electronics Establishes Plextek Group HVAC Production Line in Gwangju…240 Billion Won Investment
Samsung Electronics has decided to establish a new HVAC production line for Plextek Group, which it acquired, in Gwangju. The company will invest 240 …
2026.08.19 by 명세환 기자