‘UCIe’ 키워드 기사 3 articles
Intel Unveils Three Agentic AI Architectures at Hot Chips 2026
Intel has unveiled three new architectures at Hot Chips 2026 to support agentic AI workloads. Diamond Rapids, Crescent Island, and Wildcat Lake are al…
2026.08.25 by 배종인 기자
SK Hynix and SanDisk Unveil First HBF Standard Specification…Presenting AI Memory Strategy at FMS 2026
SK Hynix and SanDisk have unveiled the first standard specification for HBF (High Bandwidth Flash). Finalized within six months, this specification su…
2026.08.05 by 배종인 기자
“Physical AI Data Solved with Ultra-High Speed Interconnect Technology”
As AI expands from the cloud to the real world, the center of gravity in semiconductor performance competition is shifting from the computing unit its…
2026.03.30 by 배종인 기자