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“Physical AI Data Solved with Ultra-High Speed Interconnect Technology”

Google 우선 소스Published2026.03.30 09:54

As AI expands from the cloud to the real world, the center of gravity in semiconductor performance competition is shifting from the computing unit itself to the interconnects that connect them. In the Physical AI era, the decisive factor ultimately depends on how fast, with low latency and power consumption, and reliably data can be transmitted. Against this backdrop, at the 'e4ds Physical AI Frontier 2026' event held at Seoul COEX on March 6th, Qualitas Semiconductor Executive Director Kim Jae-young delivered a presentation on the theme of "On-Device AI Semiconductors and High-Speed Interconnect Elements in the Physical AI Era," emphasizing the importance of high-speed interface technology that determines AI performance.

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인피니언 8월20일부터
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