Gartner "Memory Sales to Reach $837.3 Billion in 2026… 280% Year-over-Year Surge"
Gartner forecasts that the global semiconductor market will reach $1.5552 trillion in 2026. Expansion of AI infrastructure investment and memory price…
2026.08.25 by 명세환 기자
SK Hynix Unveils Next-Generation AI Infrastructure Blueprint Based on Optical Interconnect
SK Hynix has disclosed its CPO (Co-Packaged Optics) roadmap, a core technology for next-generation AI infrastructure, to Nature Electronics. To addres…
2026.08.21 by 배종인 기자
[EDA Great Transformation ③] Korea Was Already in the Midst of the EDA War
Competition among global EDA companies is intensifying in the Korean market, centered on Samsung's 2nm and HBM and 3D stacking. AI-based design automa…
2026.08.12 by 배종인 기자
SK Hynix Decides on 54 Trillion Won Investment in Yongin Y2 and Cheongju M17
SK Hynix will invest a total of 54 trillion won in Yongin and Cheongju to construct new semiconductor fabs in response to expanding AI demand. The Yon…
2026.08.10 by 배종인 기자
Samsung Electronics unveils zHBM and V10 BV-NAND mockups at FMS 2026
Samsung Electronics unveiled for the first time next-generation 3D memory architecture zHBM and V10 BV-NAND mockups at FMS 2026. zHBM features a struc…
2026.08.05 by 배종인 기자
SK Hynix and SanDisk Unveil First HBF Standard Specification…Presenting AI Memory Strategy at FMS 2026
SK Hynix and SanDisk have unveiled the first standard specification for HBF (High Bandwidth Flash). Finalized within six months, this specification su…
2026.08.05 by 배종인 기자
Intel Accelerates Advanced Packaging Technology at New Mexico Fab
Intel is accelerating the development of advanced packaging technologies including Foveros, EMIB, and EMIB-T at its New Mexico Fab 9. This effort aims…
2026.07.30 by 배종인 기자
SK Expands AI Infrastructure Cooperation with Nvidia, Microsoft, and Antropic
SK Group expanded AI infrastructure cooperation with global tech giants including NVIDIA, Microsoft, Anthropic, and AWS at the K-AI Summit. SK Telecom…
2026.07.26 by 배종인 기자
Samsung Electronics and Broadcom Sign $200 Billion MOU Over 5 Years
Samsung Electronics and Broadcom are pursuing strategic cooperation worth a total of $200 billion through 2030. In response to the expansion of AI inf…
2026.07.26 by 배종인 기자
SEMI Forecasts $52 Billion in 300mm Memory Equipment Investment by 2026
SEMI forecasts that global 300mm memory fab equipment investments will reach $52 billion in 2026, representing a 29% year-over-year increase. DRAM inv…
2026.06.30 by 배종인 기자
Applied Technologies Unveils 6 Semiconductor Equipment Models Supporting 3D Chip Architecture
Applied Materials has unveiled six new semiconductor manufacturing equipment solutions to address growing AI computing demands and the expansion of 3D…
2026.06.29 by 배종인 기자
Ansys Korea Shares AI Engineering Strategy at First Domestic Forum Since Integration
Ansys Korea held the 'Ansys Executive Forum 2026' and shared engineering innovation strategies for the AI era. This forum, the first to be held domest…
2026.06.15 by 명세환 기자
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Gartner: “AI Data Center Power Demand Surges, Power Consumption to Increase by 26% by 2026”
Gartner projects that global data center power consumption will increase by approximately 26% year-over-year before 2026, and analysis indicates that …
2026.06.12 by 배종인 기자
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SK Hynix Transforms from AI Memory Supplier to Infrastructure Architect… Solidifies Triangular Alliance in Taiwan
SK Group Chairman Chey Tae-won met consecutively with the heads of NVIDIA, TSMC, and Foxconn in Taipei, Taiwan from the 1st to the 4th, formalizing SK…
2026.06.04 by 배종인 기자
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Air Liquide Signs Gas Supply Contract with SK Hynix for HBM Semiconductor Process
Industrial gas company Air Liquide has signed a long-term contract with SK Hynix for the supply of semiconductor process gases. The agreement includes…
2026.06.04 by 배종인 기자