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Broadcom Announces Bluetooth Smart SoC Supporting Wireless Charging

2013.12.27 by 명세환 기자

Freescale Announces Powerful High-Speed CAN Transceivers for Industrial and Automotive

2013.12.27 by 명세환 기자

Silicon Labs Completes Smart Interface Portfolio with Release of USB-SPI Bridge Chip

2013.12.27 by 명세환 기자

STMicroelectronics Launches ISO8200B Isolated Power Switch for Industrial Automation Systems

2013.12.27 by 명세환 기자

Broadcom Launches Automotive Bluetooth Software Stack, Enabling Seamless Android Connectivity in Vehicles

2013.12.27 by 명세환 기자

Xilinx Introduces 20nm All Programmable UltraScale Portfolio with ASIC-Class Architecture and ASIC-Strength Design Solutions

2013.12.27 by 명세환 기자

Xilinx Achieves Industry Record with 4.4M Logic Cells, Doubling Highest Capacity Device Density One Generation Ahead

2013.12.27 by 명세환 기자

TI Launches Industry's Most Flexible Haptic and Capacitive Touch Combo Solution to Realize 'Haptics for Everyone'

2013.12.27 by 명세환 기자

NXP Launches Ultra-High Efficiency, Smallest CAN System-Based Chip for In-Vehicle Networks

2013.12.27 by 명세환 기자

Linear's Quad PHY Interface Realizes a Robust Multiport IoLink Master

2013.12.27 by 명세환 기자

STMicroelectronics Launches Two Moisture-Proof RF Power Transistors

2013.12.27 by 명세환 기자

TI Takes MCU Performance to the Next Level in Advanced Industrial Applications with the C2000™ Delfino™ F2837xD Series, the Industry's Highest Performance Dual-Core MCU

2013.12.27 by 명세환 기자

Silicon Labs Targets IoT with Ultra-Low Power, Ultra-Small Form Factor Wireless MCU

2013.12.27 by 명세환 기자

Analog Devices Expands High ESD Switch Product Line with Latch-Up Protection for High-Voltage Industrial Applications

2013.12.27 by 명세환 기자

TI Launches Next-Generation Power Factor Correction Controller to Enhance Energy Efficiency

2013.12.06 by 명세환 기자