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TI launches interface IC supporting up to 4K2K maximum screen resolution for tablets, notebooks and all-in-one PCs

2013.12.27 by 명세환 기자

CSR, First Bluetooth 4.1 Standard Solution Certified

2013.12.27 by 명세환 기자

Analog Devices' MEMS technology integrated into Withings' 'Pulse' activity monitor

2013.12.27 by 명세환 기자

Agilent Korea Launches New EXM Wireless Test Set

2013.12.27 by 명세환 기자

Linear, 42V, 3.5A (IOUT), 2.2MHz Synchronous Step-Down DC/DC Converter Launch

2013.12.27 by 명세환 기자

Silicon Image Launches Industry's First MHL® 3.0 4K Ultra HD Solution for Mobile Devices

2013.12.27 by 명세환 기자

Broadcom Announces Bluetooth Smart SoC Supporting Wireless Charging

2013.12.27 by 명세환 기자

Freescale Announces Powerful High-Speed CAN Transceivers for Industrial and Automotive

2013.12.27 by 명세환 기자

Silicon Labs Completes Smart Interface Portfolio with Release of USB-SPI Bridge Chip

2013.12.27 by 명세환 기자

STMicroelectronics Launches ISO8200B Isolated Power Switch for Industrial Automation Systems

2013.12.27 by 명세환 기자

Broadcom Launches Automotive Bluetooth Software Stack, Enabling Seamless Android Connectivity in Vehicles

2013.12.27 by 명세환 기자

Xilinx Introduces 20nm All Programmable UltraScale Portfolio with ASIC-Class Architecture and ASIC-Strength Design Solutions

2013.12.27 by 명세환 기자

Xilinx Achieves Industry Record with 4.4M Logic Cells, Doubling Highest Capacity Device Density One Generation Ahead

2013.12.27 by 명세환 기자

TI Launches Industry's Most Flexible Haptic and Capacitive Touch Combo Solution to Realize 'Haptics for Everyone'

2013.12.27 by 명세환 기자

NXP Launches Ultra-High Efficiency, Smallest CAN System-Based Chip for In-Vehicle Networks

2013.12.27 by 명세환 기자