Apex.AI and LG Electronics Join Hands to Develop HPC for SDV
Apex.AI, a leading provider of reliable and certified software for mobility, and LG Electronics, a global leader in electronics, have signed an MOU an…
2024.12.18 by 배종인 기자
SK Hynix Completes Development of High-Capacity SSD 'PS1012 U.2' for AI Data Centers
SK Hynix announced on the 18th that it has completed the development of 'PS1012 U.2', a high-capacity SSD (Solid State Drive) product for AI data cent…
2024.12.18 by 권신혁 기자
Bitsensing and NXP join hands for high-performance, scalable radar system
Leading-edge radar solution company bitsensing has embarked on a joint development project with NXP Semiconductors to create a high-performance scalab…
2024.12.18 by 배종인 기자
Etiphos and HFR join hands for autonomous driving technology and business
Etipos Co., Ltd. (CEO Kim Ho-jun), a specialist in C-V2X modem solutions, and HFR Co., Ltd. (CEO Jung Jong-min), an ICT networking specialist, have si…
2024.12.18 by 배종인 기자
ROHM Launches 'TVS Diode' Supporting High-Quality CAN FD Communications
ROHM has developed the 'ESDCANxx Series,' a bidirectional TVS (ESD protection) diode compatible with CAN FD (CAN with Flexible Data rate) for high-spe…
2024.12.18 by 배종인 기자
[EMI/EMC Expert Talk⑤] CEO Park Hak-byeong, “EM Engineers, Pay Attention to LLM Utilization”
[Editor's Note] AI convergence development in the electromagnetic field is progressing rapidly. As AI technology begins to converge across all industr…
2024.12.18 by 권신혁 기자
[CES 2025] Elektrobit Unveils SDV Roadmap from Cloud to Cockpit
Elektrobit unveils an open source-based software-defined vehicle roadmap spanning from cloud to cockpit at CES 2025, presenting its software-defined m…
2024.12.18 by 배종인 기자
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The certification test for the finished product of a large-scale wind turbine blade is conducted in Korea.
The Korea Institute of Materials Science (KIMS, President Choi Chul-jin) Wind Power Core Technology Research Center (Director Park Ji-sang, Principal …
2024.12.18 by 배종인 기자
Onsemi, Denso Strengthen Cooperation to Support Automotive Technology
ON Semiconductor announced on the 17th that it will strengthen long-term cooperative relations with DENSO CORPORATION, an automotive component excelle…
2024.12.17 by 명세환 기자
Microchip Unveils Tiny CAN FD SBC... Perfect for Space-Constrained Applications
As the use of connected applications in automotive and industrial markets continues to increase, demand for wired connectivity solutions with higher b…
2024.12.17 by 명세환 기자
2025 Infrastructure Trends: 'Private AI', 'Edge', 'Hybrid'
Equinix announced on the 16th five technology infrastructure trends that will lead Korea's business and technology sectors in 2025. Equinix presented…
2024.12.17 by 명세환 기자
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Hanjayeon, 15th Asset Report 2024 Mobility Industry Settlement
The Korea Automotive Research Institute (President Na Seung-sik) held the 15th Sasan Eobo event on the 16th at COEX Startup Branch in Gangnam-gu, Seou…
2024.12.17 by 배종인 기자
China, Trump's trade war response 'domestic demand boost'... stock market crisis and opportunity points
As the second Trump administration signals drastic changes in the external trade environment through advanced technology sanctions and tariff policies…
2024.12.16 by 권신혁 기자
Infineon contributes to data center energy savings with industry's highest current density power module
Infineon Technologies (Korea CEO Lee Seung-soo) has launched the TDM2354xD and TDM2354xT dual-phase power modules featuring best-in-class power densit…
2024.12.16 by 배종인 기자
“Non-digital equipment is vulnerable, IIoT solution simplification is essential”
Hilscher, a leading company in industrial communication and automation, forecasted at SPS (Smart Production Solutions) 2024 that critical vulnerabilit…
2024.12.16 by 배종인 기자