ACM Research has been recognized for its outstanding technology in semiconductor and wafer-level packaging (WLP) applications.

ACMR recently announced that it has won the 2025 3D InCites Technology Enablement category award.

This award recognizes companies that have played a key role in advancing the heterogeneous integration roadmap in the semiconductor and packaging industries, demonstrating that ACM's innovative technologies are driving progress in the industry.

ACM Research introduced the Ultra C ECP ap-p system as the key product for this award.

This system is the first commercial, high-volume copper deposition system capable of processing large panels in fan-out panel level packaging (FOPLP) processes.

The Ultra C ECP ap-p system adopts a horizontal plating method to maximize uniformity and precision across the entire panel.

It can also process panels measuring 515 mm x 510 mm and 600 mm x 600 mm, and is available for processes such as filler, bump, and redistribution layer (RDL) formation.

David Wang, CEO of ACM Research, said of the award, “This award is recognition of ACM’s continued efforts to solve customer challenges in panel-level packaging (PLP).“The growing demand for large chiplets, high-performance GPUs and high-density high-bandwidth memory (HBM) is driving panel-level packaging (PLP) to become a key solution for cost reduction and efficiency improvement. The Ultra C ECP ap-p system is an important addition to ACM’s FOPLP portfolio and will strengthen our efforts to further advance high-volume manufacturing solutions,” he said.