Texas Instruments (TI) has introduced new power modules that utilize MagPack™ technology, a leading magnetic packaging technology for power modules, that are up to 50 percent smaller than previous generations and double the power density while maintaining excellent thermal performance.

TI Korea (CEO Joong-Seo Park) announced on the 15th that it has released six new power modules designed to improve power density, increase efficiency, and reduce EMI.

These power modules leverage TI's proprietary MagPack integrated magnetic packaging technology to reduce size by up to 23 percent over competitive modules, enabling engineers for industrial, enterprise and communications applications to achieve improved performance levels.

In particular, three of the six new devices—the TPSM82866A, TPSM82866C, and TPSM82816—are the industry’s smallest 6A power modules, offering industry-leading power density of approximately 1A per square millimeter.

“Engineers have traditionally used power modules to reduce time, complexity, size and component count, but at the expense of some level of performance,” said Jeff Morroni, director of power management R&D at TI’s Kilby Labs. “TI’s integrated magnetic packaging technology, developed over nearly a decade, is a step forward.” “With this, power design engineers can now meet today’s power trends that require more power in smaller spaces, efficiently and cost-effectively,” he said.

In power design, size is a critical factor. Power modules combine power chips and transformers or inductors into a single package, simplifying power design and saving valuable board space. MagPack packaging technology, utilizing TI’s proprietary 3D package molding process, maximizes the height, width and depth of power modules, enabling more power in a smaller space.

MagPack magnetic packaging technology includes a newly designed, proprietary material integrated power inductor. As a result, engineers can achieve best-in-class power density, reduce temperature and radiant emissions, while minimizing both board space and system power loss.

With some analysts today predicting that electricity demand will increase by 100% by the end of the decade, the ability to minimize power losses is especially important in applications such as data centers where power is the largest cost factor.

TI's power modules feature a portfolio of more than 200 devices, comprised of decades of expertise, innovative technologies and package types optimized for the power design or application, to help designers further enhance their power.

Pre-production quantities of the new power modules with MagPack packaging technology and evaluation modules starting at $49 are available now on TI.com with multiple payment and shipping options.