Japanese semiconductor manufacturer ROHM has achieved a significant contribution to the miniaturization and efficient use of space in power conversion circuits by reducing mounting area by approximately 52% through a new SiC module optimized for onboard chargers (OBCs) for electric vehicles.


ROHM announced on the 24th that it has developed a new SiC mold type module, “HSDIP20,” that will become a defacto standard in onboard chargers (OBCs) for electric vehicles (xEVs).

This new module is designed to maximize the efficiency and miniaturization of power conversion systems, and has a diverse lineup including six types with a withstand voltage of 750 V (BSTxxx1P4K01) and seven types with a withstand voltage of 1,200 V (BSTxxx2P4K01).

The HSDIP20 is designed in 4-in-1 and 6-in-1 configurations optimized for PFC (Power Factor Correction) and LLC converters.

In particular, it features an insulating substrate with high heat dissipation performance, which effectively suppresses the rise in chip temperature during high-power operation.

As a result of comparing the existing top-surface heat dissipation type discrete 6 and 6-in-1 configuration HSDIP20 under the same conditions in the PFC circuit of an actual OBC, it was confirmed that the temperature of HSDIP20 was maintained approximately 38℃ lower (25W(Poem).

Additionally, ROHM's new module achieves industry-leading power density and has a current handling capability that is more than three times higher than conventional discrete methods.

Compared to the same DIP type module, the power density is increased by 1.4 times, which allows the mounting area in the power conversion circuit of the OBC to be reduced by approximately 52%.

This is expected to greatly contribute to the miniaturization and efficient use of space in power conversion circuits.

ROHM has started mass production of this new module at a monthly production capacity of 100,000 units from April 2025.