First application to Arm SecurCore SC300 processor
| WLCSP, GSMA Utilizing PoW Industrial Process Benefits
| ST, first to obtain GSMA SAS-U in 2018

STMicroelectronics announced on the 21st that cumulative sales of its embedded security IC 'ST33' have surpassed 1 billion units. It has been about 3 years and 2 months since it surpassed 500 million in December 2015.
The popularity of the ST33 product family suggests that data and system protection is becoming an increasingly essential requirement in secure mobile consumer devices, smart driving, smart industry, and smart city applications.

Through the flexible architecture of the ST33 family, which is based on a certified general-purpose security platform with state-of-the-art cyber protection capabilities, ST is leading the development of new levels of security chips, including eSIM (embedded SIM), eSE (embedded Secure Element), and TPM (Trusted Platform Module).

These products offer robust protection against cyber attacks and convenience, along with enhanced security in a user-friendly form factor.

Laurent Degauque, Senior Vice President of Marketing for ST’s Security Microcontrollers, said, “The ST33 chip has led the embedded security revolution in ubiquitous connected smart things that drive today’s world, such as smartphones, wearables, and IoT devices.”

He continued, “As the first device to feature the Arm SecurCore SC300 security processor, this product family offers the advantages of ST’s flexible architecture and advanced flash technology, continuously providing protection that meets the highest industry standards.“We have been providing [it],” they stated, adding, “it enables the integration of new features such as interfaces and accelerators to support new application fields.”

ST33 is an embedded security platform of choice for major Tier 1 manufacturers producing devices such as smartphones, wearables, security readers, desktop PCs, and servers, along with SIM suppliers and operating system developers.

Major smartphone OEMs are adopting this ST33 security chip to implement new eSIM-based devices, taking advantage of the smaller and thinner Wafer Level Chip Scale Package (WLCSP) package and the benefits of the GSMA-compliant Personalization-on-Wafer (PoW) industrial process.

ST is the first chip manufacturer to obtain GSMA SAS-UP (Security Accreditation Scheme for UICC Production) certification in 2018, enabling the customization of ST33 eSIMs for mobile and connected IoT devices without the additional programming that OEMs had to do.

The ST33 security microcontroller is available in various forms to allow for the selection of multiple features, including industrial and automotive-grade certifications, connectivity as an NFC controller, and hardware accelerators for advanced encryption capabilities.