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Infineon Launches 16-Phase 1000A Voltage Regulator for Next-Generation CPUs/GPUs/FPGAs/ASICs
| For CPU, GPU, FPGA, ASIC
| Provides current of 500~1000A or more
No redundant logic doubler IC required
Infineon Technologies announced on the 4th that it is adding the 16-phase digital PWM multiphase controller XDPE132G5C to its high-current system chipset solutions. 
Infineon XDPE132G5C QFN
Infineon's high-current system chipset solutions provide over 500 to 1,000 A of current for next-generation CPUs, GPUs, FPGAs, and ASICs used in high-end AI servers and 5G datacom applications.
As CPU current requirements increase to run next-generation AI and networking workloads, DC-DC voltage regulators must supply more than 500A to the load. The XDPE132G5C controller supports these high phase count requirements with a 16-phase digital PWM engine and an enhanced transient algorithm.
True active current sharing between phases enables stable, compact, and low-cost designs. Redundant logic doubler ICs, commonly used in the multiphase controller market, are not required.
Advanced ASICs and FPGAs used in communication systems require Vout control of less than 1 mV step. This feature is built into the XDPE132G5C and provides Vout settings in 0.625 mV steps. It also supports the automatic restart requirements of the communications market, offering an option to reduce remote maintenance caused by power or system failures.
The XDPE132G5C is available in a 7mm x 7mm 56-pin QFN package accommodating 16 phases. The XDPE132G5C is a PMBus 1.3/AVS compliant product that uses digital and programmable load lines and provides comprehensive telemetry capabilities. When used in conjunction with the TDA21475, a highly integrated current-sensing power stage with excellent thermal efficiency, it can efficiently deliver over 1000A.
The TDA21475 power stage product, available in a 5 mm x 6 mm package with a rated current of 70 A, provides an efficiency of over 95%. The exposed top significantly reduces Rth(j-top) to 1.6°C/W (compared to 19°C/W for the molded package). By efficiently removing heat from the top of the package, excellent VR power density and optimal VR phase count and footprint can be achieved.
The TDA21475 provides smart overcurrent and overvoltage protection to further maximize CPU/ASIC performance and transmits accurate temperature and current information to the XDPE132G5C controller.
| Provides current of 500~1000A or more
No redundant logic doubler IC required
Infineon Technologies announced on the 4th that it is adding the 16-phase digital PWM multiphase controller XDPE132G5C to its high-current system chipset solutions.

Infineon XDPE132G5C QFN
Infineon's high-current system chipset solutions provide over 500 to 1,000 A of current for next-generation CPUs, GPUs, FPGAs, and ASICs used in high-end AI servers and 5G datacom applications.
As CPU current requirements increase to run next-generation AI and networking workloads, DC-DC voltage regulators must supply more than 500A to the load. The XDPE132G5C controller supports these high phase count requirements with a 16-phase digital PWM engine and an enhanced transient algorithm.
True active current sharing between phases enables stable, compact, and low-cost designs. Redundant logic doubler ICs, commonly used in the multiphase controller market, are not required.
Advanced ASICs and FPGAs used in communication systems require Vout control of less than 1 mV step. This feature is built into the XDPE132G5C and provides Vout settings in 0.625 mV steps. It also supports the automatic restart requirements of the communications market, offering an option to reduce remote maintenance caused by power or system failures.
The XDPE132G5C is available in a 7mm x 7mm 56-pin QFN package accommodating 16 phases. The XDPE132G5C is a PMBus 1.3/AVS compliant product that uses digital and programmable load lines and provides comprehensive telemetry capabilities. When used in conjunction with the TDA21475, a highly integrated current-sensing power stage with excellent thermal efficiency, it can efficiently deliver over 1000A.
The TDA21475 power stage product, available in a 5 mm x 6 mm package with a rated current of 70 A, provides an efficiency of over 95%. The exposed top significantly reduces Rth(j-top) to 1.6°C/W (compared to 19°C/W for the molded package). By efficiently removing heat from the top of the package, excellent VR power density and optimal VR phase count and footprint can be achieved.
The TDA21475 provides smart overcurrent and overvoltage protection to further maximize CPU/ASIC performance and transmits accurate temperature and current information to the XDPE132G5C controller.
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