TI Korea (CEO Kent Jeon, www.ti.com/ww/kr ) July 20, 2012 – TI (CEO Kent Jeon) has launched the industry's smallest integrated step-up (boost) DC/DC power module for smartphones, tablets, and a wide variety of other portable electronic devices. The efficient new TPS81256 MicroSiP™ converter integrates inductors and I/O capacitors to achieve a solution with a size of less than 9 mm² and a height of less than 1 mm, simplifying designs while reducing board space by up to 50% compared to competing solutions. (For more information on samples, evaluation modules, and more, please refer to www.ti.com/tps81256-pr )

Smallest integrated boost converter
Smartphone and tablet designers are continuously demanding smaller point-of-load (POL) converters that maintain long battery life through high power conversion efficiency. The 4 MHz, 600 mA TPS81256 module supports 5 V output while providing a power density of 400 mW/mm³. This device extends battery life by reducing the supply current to 43 µA during light-load operation. The TPS81256 can also efficiently manage 3W across the entire voltage range of a lithium-ion battery by achieving a power efficiency of over 90% for an input voltage of 2.5V to 5.5V.

Key Features and Advantages of the TPS81256
• Smallest solution size: Achieving a solution with a size of 9 mm² or less and a height of less than 1 mm, providing a power density of 400 mW/mm³.
• Design Simplification: Reduces effort in hardware design and layout through high integration, including passive components and capacitors.
• High Performance: Provides peak efficiency of up to 91% and high efficiency across the entire load range

The most extensive POL solution
TI provides the most extensive range of power management ICs and modules for POL designs, including step-up and step-down converters for portable and line power systems. These range from ultra-low power DC/DC converters with or without integrated FETs to fully integrated power solutions such as the TPS81K, TPS82K, TPS84K, and SIMPLE SWITCHER® modules.

Supply timing and price
The TPS81256 is currently available in a 9-bump 2.6mm x 2.9mm x 1mm MicroSiP package suitable for automated assembly with standard surface mount equipment, and is priced at $1.7 per unit in a quantity of 1,000. Designers can order the new TPS81256EVM-121 evaluation module to help shorten time to market.

More detailed information on TI's power module portfolio
• TI's TPS82K Step-Down Integrated Power Module for Portable Electronics: www.ti.com/tps82-prkr
• SIMPLE SWITCHER Power Module: www.ti.com/switcher
• Q&A and troubleshooting support via the TI E2E™ community's Power Forum: www.ti.com/powerforum-prkr
• Download TI's new 2012 Power Management Selection Guide: www.ti.com/powerguide-pr