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NXP's integrated solution featuring a PCB five times smaller than existing RF designs
NXP Semiconductors has launched a portfolio of RF power multi-chip modules (MCMs) to support the development of large-scale MIMO active antenna systems for 5G base stations.
NXP's 5G Airfast solution is based on highly integrated technologies, such as compact power amplifiers, shortened design cycles, and simplified manufacturing processes.
"Paul Hart, Senior Vice President of Radio Power Solutions at NXP, said, '5G infrastructure networks are being deployed faster than in previous generations. NXP's large-scale 5G MIMO solutions provide the same frequency and power coverage, enabling NXP customers and network mobile operators to shorten time-to-market.'"
NXP’s RF power multi-chip module is a two-stage device with 50-ohm inputs and outputs that integrates Doherty, freeing it from RF complexity, eliminating the need for multiple prototype passes, and making it easier to predict the design in advance.
Pin compatibility is also possible, significantly enhancing design reusability. It appears that reducing the number of components will help simplify the construction of 5G base stations by avoiding unnecessary redundant testing, increasing yield, and significantly reducing the time required for quality control.
NXP stated that the newly announced all-in-one 5G mMIMO RF power amplifier module is an integrated solution featuring a PCB that is five times smaller than existing RF designs, and resolves size and weight-related issues for high-order mMIMO such as the 64T64R, which requires 64 power amplifiers per antenna.
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