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Infineon Develops World's Smallest 3D Image Sensor

Google 우선 소스Published2020.01.08 16:07
Ultra-small 3D image sensor chip IRS2887 unveiled at CES 2020
Providing an enhanced augmented reality experience with high-resolution, low-power products


Infineon unveiled the world's smallest 3D image sensor at CES 2020.

▲ Infineon has launched the world's smallest 3D image sensor <Image=Infineon>

3D sensors can enable realistic augmented reality experiences, including enhanced facial recognition and photography functions, and can play a key role in applications such as smartphones that rely on accurate 3D image data.

Infineon Technologies, in collaboration with pmd Technologies, a company specializing in software and 3D ToF systems, developed the ultra-small 3D image sensor chip IRS2887 and unveiled it at CES 2020, the world's largest IT and consumer electronics show, held in Las Vegas, USA, from January 7 to 10.

The product unveiled this time is Infineon's REAL3 single-chip solution, which is a 5th generation ToF depth sensor chip. It provides the best resolution data in a 4.4x5.1mm size while achieving low power consumption.


Depth sensor ToF technology
ToF technology is a technology that enables the generation of accurate 3D images of detailed parts or objects, such as faces and hands, when it is necessary to verify whether the image matches the original.

This technology has already been applied to devices that do not require bank cards or cashiers, as well as to payment transactions using mobile phones, and is a service that enables payment solely through facial recognition.

Infineon has successfully developed high-resolution 3D image data and return transmission technology required for ToF implementation. Furthermore, it operates accurately even under extreme lighting conditions, such as strong sunlight or darkness.

The REAL3 single chip offers additional options for photography, including autofocus, bokeh effects for photos and videos, and the technology to achieve high resolution even in poor lighting conditions.

In addition, real-time full 3D mapping enables a realistic augmented reality experience.


Andreas Urschitz, President of Infineon’s Power Management and Multimarket business unit, stated, “The product introduced is Infineon’s 5th generation REAL3 chip, which boasts robustness and high reliability, as well as powerful energy efficiency and an ultra-compact size. With 3D sensors, devices can be controlled via gestures, allowing for convenient interaction with machines without the need for touch.”
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