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Investing 1 trillion won over 10 years in the development of next-generation intelligent semiconductors
Published2020.01.20 16:27Ministry of Science and ICT and Ministry of Trade, Industry and Energy Accelerate Development of AI Semiconductors, New Devices, and Microfabrication Technologies
Fostering SoC design technology for automobiles, high-tech home appliances, bio, energy, robotics, etc.
The government has joined forces to respond to the changing semiconductor market in the era of the Fourth Industrial Revolution and to change the unbalanced industrial structure centered on memory.
The Ministry of Science and ICT and the Ministry of Trade, Industry and Energy will invest 1 trillion won over 10 years with the goal of securing core and source technologies for next-generation intelligent semiconductors. This is the first time in the last five years that an R&D project subject to a preliminary feasibility study has exceeded 1 trillion won.
The Ministry of Science and ICT and the Ministry of Trade, Industry and Energy will invest 1 trillion won in the development of intelligent semiconductors over 10 years.
On January 20, the Ministry of Science and ICT and the Ministry of Trade, Industry and Energy announced plans to implement projects for the development of world-class next-generation intelligent semiconductor technologies, including artificial intelligence semiconductors, advanced semiconductors for key industries, new low-power and high-performance devices, and atomic-level microfabrication technology.
The Ministry of Science and ICT is pursuing the development of future devices to reduce power consumption and achieve high performance (42.4 billion KRW in 2020), and the Ministry of Trade, Industry and Energy is pursuing the development of atomic-level process and equipment technologies to overcome miniaturization limitations (46.7 billion KRW in 2020), and they are jointly responding to the development of design technologies to improve computational speed.
With a total of 89.1 billion won to be invested in 2020 and 1 trillion won over the next 10 years, technologies covering the entire cycle, including devices, design, equipment, and processes, will be developed. The final projects were selected through a project planning committee involving external experts from various fields and a technology demand survey involving industry, academia, and research institutes.
Development of artificial intelligence semiconductor design technology
We develop platform technology that integrates AI processors (NPU, etc.), ultra-high-speed interfaces, and software (compilers, etc.), taking into account the product completeness and reliability of AI semiconductors.
Developing platform technologies for server, mobile, and edge fields depending on the application, and leading the global market with innovative products such as AI processors (NPUs) featuring world-class computational performance and power efficiency.Secure the alcohol.
The developed platform technology supports the reduction of time and costs required for AI semiconductor development so that specialized design firms (fabless) and others can utilize it for product development and verification; to this end, a platform community involving industry, academia, and research institutes is operated.
Project implementing organizations are selected in a consortium format to strengthen connectivity between detailed tasks for each platform, and support is provided for the participation of fabless and IP specialized companies and talent development to enable the early establishment of an artificial intelligence semiconductor industry ecosystem.
Technology development in the field of new materials
The field of novel devices focuses on fostering areas capable of securing source IP, with the goal of developing new ultra-low power, high-performance devices to overcome the limitations of existing devices.
To this end, the Ministry of Science and ICT provides 11.5 billion won for the development of source technologies for new devices based on various principles, 4.5 billion won for the development of integration and verification technologies to link the early commercialization of developed technologies, and 1.4 billion won for challenging basic technologies based on creative ideas.
For source technologies for new devices, a competitive R&D approach is introduced, and the continuation of support is determined through phased evaluations. At the time the first phase of research, which is the fifth year of the project, is completed, device technologies capable of joint research with the design field will be intensively identified, and in the second phase, ultra-low power artificial intelligence semiconductors will be realized through full-scale device and design convergence research.
▲ The government supports the development of system semiconductor design technologies, such as automotive SoCs.
Development of next-generation semiconductor design technology
We develop system-on-a-chip (SoC) design technologies required by the market in conjunction with five strategic industries, including automobiles, high-tech home appliances, medical and bio, energy, and high-tech robots, as well as public demand.
We develop five core technologies applicable to various applications, including lightweight processors, storage, sensing, connectivity and security, and control and actuation.
Representative projects starting in 2020 include: a vehicle communication SoC with enhanced multi-signal processing and security functions for safe autonomous driving; an integrated display SoC for self-image enhancement and AR/VR; an electronic ankle monitor SoC for 5G-based crime prevention; and an SoC for detecting gas leaks in underground buried facilities.
At the time of project conclusion, it supports the strengthening of capabilities across the entire system semiconductor ecosystem, including world-class high-resolution display driver SoCs, ultra-high-speed data transmission SoCs, and ultra-long-range situational awareness SoCs.
Development of equipment and process technology for microfabrication
In the equipment and process sectors, process miniaturization, which is the core of semiconductor manufacturing competitiveness, We develop equipment and component technologies for microprocessing.
In 2020, the focus will be on ▲atomic-level deposition equipment and automated inspection technology for manufacturing next-generation memory and high-density system semiconductors ▲heat treatment and neutron-based software error detection technology for next-generation high-density packages.
By the time the project ends, it will support the strengthening of the overall competitiveness of the semiconductor industry by securing world-class semiconductor manufacturing process equipment for 10 nanometers or smaller and 3D packaging equipment technology.
To strengthen inter-sectoral linkage and cooperation and private-sector-led project execution for the next-generation intelligent semiconductor technology development project, a single project team will be established. By dividing roles across sectors ranging from project planning to evaluation and management, fairness, expertise, and efficiency will be enhanced.
▲ The government is focusing on the development of artificial intelligence semiconductors to leap beyond being a memory powerhouse into a comprehensive semiconductor powerhouse.
Minister of Science and ICT Choi Ki-young said, “Artificial intelligence semiconductors are a key element and battleground in the competition for global leadership in the AI era, but the industry is still in its early stages with no dominant player,” adding, “If we secure core technologies one step ahead, we can not only lead the global market but also develop world-class artificial intelligence semiconductors.”
Minister of Trade, Industry and Energy Sung Yun-mo stated, “System semiconductors are a core component of the Fourth Industrial Revolution and one of the three major new industries, along with future vehicles and biotechnology, that will be responsible for our future growth engines,” adding, “Based on our world-leading technological capabilities in the memory semiconductor field, the core of the next-generation semiconductor sector"By securing core technology, we will leap beyond being a memory powerhouse to become a comprehensive semiconductor powerhouse," they stated.
Fostering SoC design technology for automobiles, high-tech home appliances, bio, energy, robotics, etc.
The government has joined forces to respond to the changing semiconductor market in the era of the Fourth Industrial Revolution and to change the unbalanced industrial structure centered on memory.
The Ministry of Science and ICT and the Ministry of Trade, Industry and Energy will invest 1 trillion won over 10 years with the goal of securing core and source technologies for next-generation intelligent semiconductors. This is the first time in the last five years that an R&D project subject to a preliminary feasibility study has exceeded 1 trillion won.
The Ministry of Science and ICT and the Ministry of Trade, Industry and Energy will invest 1 trillion won in the development of intelligent semiconductors over 10 years.
On January 20, the Ministry of Science and ICT and the Ministry of Trade, Industry and Energy announced plans to implement projects for the development of world-class next-generation intelligent semiconductor technologies, including artificial intelligence semiconductors, advanced semiconductors for key industries, new low-power and high-performance devices, and atomic-level microfabrication technology.
The Ministry of Science and ICT is pursuing the development of future devices to reduce power consumption and achieve high performance (42.4 billion KRW in 2020), and the Ministry of Trade, Industry and Energy is pursuing the development of atomic-level process and equipment technologies to overcome miniaturization limitations (46.7 billion KRW in 2020), and they are jointly responding to the development of design technologies to improve computational speed.
With a total of 89.1 billion won to be invested in 2020 and 1 trillion won over the next 10 years, technologies covering the entire cycle, including devices, design, equipment, and processes, will be developed. The final projects were selected through a project planning committee involving external experts from various fields and a technology demand survey involving industry, academia, and research institutes.
Development of artificial intelligence semiconductor design technology
We develop platform technology that integrates AI processors (NPU, etc.), ultra-high-speed interfaces, and software (compilers, etc.), taking into account the product completeness and reliability of AI semiconductors.
Developing platform technologies for server, mobile, and edge fields depending on the application, and leading the global market with innovative products such as AI processors (NPUs) featuring world-class computational performance and power efficiency.Secure the alcohol.
The developed platform technology supports the reduction of time and costs required for AI semiconductor development so that specialized design firms (fabless) and others can utilize it for product development and verification; to this end, a platform community involving industry, academia, and research institutes is operated.
Project implementing organizations are selected in a consortium format to strengthen connectivity between detailed tasks for each platform, and support is provided for the participation of fabless and IP specialized companies and talent development to enable the early establishment of an artificial intelligence semiconductor industry ecosystem.
Technology development in the field of new materials
The field of novel devices focuses on fostering areas capable of securing source IP, with the goal of developing new ultra-low power, high-performance devices to overcome the limitations of existing devices.
To this end, the Ministry of Science and ICT provides 11.5 billion won for the development of source technologies for new devices based on various principles, 4.5 billion won for the development of integration and verification technologies to link the early commercialization of developed technologies, and 1.4 billion won for challenging basic technologies based on creative ideas.
For source technologies for new devices, a competitive R&D approach is introduced, and the continuation of support is determined through phased evaluations. At the time the first phase of research, which is the fifth year of the project, is completed, device technologies capable of joint research with the design field will be intensively identified, and in the second phase, ultra-low power artificial intelligence semiconductors will be realized through full-scale device and design convergence research.
▲ The government supports the development of system semiconductor design technologies, such as automotive SoCs.
Development of next-generation semiconductor design technology
We develop system-on-a-chip (SoC) design technologies required by the market in conjunction with five strategic industries, including automobiles, high-tech home appliances, medical and bio, energy, and high-tech robots, as well as public demand.
We develop five core technologies applicable to various applications, including lightweight processors, storage, sensing, connectivity and security, and control and actuation.
Representative projects starting in 2020 include: a vehicle communication SoC with enhanced multi-signal processing and security functions for safe autonomous driving; an integrated display SoC for self-image enhancement and AR/VR; an electronic ankle monitor SoC for 5G-based crime prevention; and an SoC for detecting gas leaks in underground buried facilities.
At the time of project conclusion, it supports the strengthening of capabilities across the entire system semiconductor ecosystem, including world-class high-resolution display driver SoCs, ultra-high-speed data transmission SoCs, and ultra-long-range situational awareness SoCs.
Development of equipment and process technology for microfabrication
In the equipment and process sectors, process miniaturization, which is the core of semiconductor manufacturing competitiveness, We develop equipment and component technologies for microprocessing.
In 2020, the focus will be on ▲atomic-level deposition equipment and automated inspection technology for manufacturing next-generation memory and high-density system semiconductors ▲heat treatment and neutron-based software error detection technology for next-generation high-density packages.
By the time the project ends, it will support the strengthening of the overall competitiveness of the semiconductor industry by securing world-class semiconductor manufacturing process equipment for 10 nanometers or smaller and 3D packaging equipment technology.
To strengthen inter-sectoral linkage and cooperation and private-sector-led project execution for the next-generation intelligent semiconductor technology development project, a single project team will be established. By dividing roles across sectors ranging from project planning to evaluation and management, fairness, expertise, and efficiency will be enhanced.
▲ The government is focusing on the development of artificial intelligence semiconductors to leap beyond being a memory powerhouse into a comprehensive semiconductor powerhouse.
Minister of Science and ICT Choi Ki-young said, “Artificial intelligence semiconductors are a key element and battleground in the competition for global leadership in the AI era, but the industry is still in its early stages with no dominant player,” adding, “If we secure core technologies one step ahead, we can not only lead the global market but also develop world-class artificial intelligence semiconductors.”
Minister of Trade, Industry and Energy Sung Yun-mo stated, “System semiconductors are a core component of the Fourth Industrial Revolution and one of the three major new industries, along with future vehicles and biotechnology, that will be responsible for our future growth engines,” adding, “Based on our world-leading technological capabilities in the memory semiconductor field, the core of the next-generation semiconductor sector"By securing core technology, we will leap beyond being a memory powerhouse to become a comprehensive semiconductor powerhouse," they stated.
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