NXP Unveils Industry's Largest Portfolio of Dual Power-SO8 MOSFET Products
Published2012.09.27 10:27September 25, 2012, Seoul – NXP Semiconductors (NASDAQ: NXPI) today launched the LFPAK56D portfolio, a family of dual-power SO8 MOSFETs specialized for automotive applications such as fuel injection, ABS, and stabilization control. Fully AEC-Q101 certified, NXP’s LFPAK56D family delivers best-in-class performance and reliability. This reduces the footprint by 77% compared to equivalent DPAK solutions that require two devices. The LFPAK56D family is currently in mass production and available for immediate use.
The LFPAK56D is designed to incorporate two discrete MOSFETs into a single package to meet the stringent requirements of the automotive industry. With the industry's widest on-resistance (RDSon) range spanning five voltage classes, this product delivers superior performance, current handling, and market reliability. This new dual-power SO8 MOSFET offers customers complete flexibility and freedom to select a device capable of achieving very high power density while optimally combining application and module requirements.
Designing with LFPAK56D can reduce costs through simpler PCB assembly, easier review, and reduced module size. A smaller module also means a significant reduction in weight, which is very attractive to manufacturers striving to reduce CO2 emissions.
Building on the expertise of the LFPAK56, the first Power-SO8 package to fully pass AEC-Q101 certification, NXP has applied the same reliable 'copper clip' bonding technology to the dual Power-SO8 MOSFETs of the LFPAK56D. This copper clip technology offers advantages in low package resistance, induction, and a high maximum ID rate.
Steve Sellick, Business Development Manager for Automotive MOSFETs at NXP Semiconductors, stated, “NXP believes the LFPAK56D will establish a new industry benchmark for automotive MOSFETs as it maximizes efficiency for OEMs and enables massive cost savings through the development of smaller and more compact components,” adding, “NXP’s portfolio of automotive Power-SO8 MOSFET certified products is the most extensive in the industry, providing customers with the widest range of choices when designing safety-sensitive automotive applications.”
Key Features
• Dual Power-SO8 MOSFET
• 77% smaller footprint compared to equivalent DPAK solutions
• Copper clip technology – No wire adhesive required
• High maximum ID rate
• Low package resistance and induction
• Low thermal resistance
• High transient current toughness
• Automotive AEC-101 certification up to 175°C
Related links
• NXP LFPADK56D Power MOSFET Portfolio: http://www.nxp.com/LFPAK56D
• Full introduction to NXP MOSFETs: http://www.nxp.com/mosfets
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