Adoption of a REAL 3D ToF sensor based on the Snapdragon 865 mobile platform

Infineon Technologies, in collaboration with Qualcomm, has developed a reference design for 3D authentication based on the Qualcomm Snapdragon 865 mobile platform.

This reference design, which features Infineon's REAL 3D ToF (Time of Flight) sensor, enables standardized and easy design integration for smartphone manufacturers.
Infineon, which has been introducing 3D ToF sensor technology to the mobile device market for the past four years, unveiled the industry's smallest (4.4 mm x 5.1 mm) and most powerful 3D image sensor with VGA resolution at CES 2020 in Las Vegas in January.

Infineon's REAL 3D ToF sensor will be the first to feature video bokeh in 5G-enabled smartphones starting in March, allowing users to enjoy optimal image effects in videos.

The received 3D image data is processed using precise 3D point cloud algorithms and software, and the 3D image sensor captures 940nm infrared light reflected from the user and target objects.

It uses high-level data processing to measure accurate depth and patented SBI (Suppression of Background Illumination) technology to provide wide coverage in all lighting conditions from bright sunlight to dark indoors. Provides a measurement range.

“Today’s smartphones go beyond simply conveying information and are incorporating security and entertainment functions,” said Andreas Urschitz, President of the Power Management and Multimarket Division at Infineon. “3D sensors enable new use cases and applications, such as secure authentication or payments via facial recognition.”