TI Mass Production of PowerStack™ Packaging Technology Products

With innovative co-packaging technology using a proprietary stacking technique
Transition from 2D to 3D integration possible for power supply designers

TI Korea (CEO Jaejin Kim, www.ti.com/ww/kr ) July 28, 2011 – TI has shipped more than 30 million products featuring PowerStack™ packaging technology. This packaging technology significantly boosts the performance of power management devices while lowering power consumption and improving chip density.

Matt Romig, TI’s Analog Packaging Manager, said, “The demand for performance improvements in computing applications continues to grow to provide more content, such as broadband mobile video and 4G communication, while at the same time, communication equipment and computing devices are required to occupy less space. PowerStack packaging technology can meet these requirements of TI customers by achieving true innovation from existing 2D to 3D integration.”

The advantage of PowerStack technology is an innovative packaging technique that stacks TI's NexFET™ power MOSFETs on a ground lead frame and connects the input voltage pins and output voltage pins using two copper (Cu) clips. This unique combination of stacking and clip bonding enables the achievement of a more integrated quad flat no-lead (QFN) solution.

The most prominent advantage of stacking MOSFETs using the PowerStack technique is that the package can be reduced by up to 50% compared to other solutions that arrange MOSFETs side-by-side. PowerStack packaging technology not only reduces board space but also enables superior thermal performance, higher current capacity, and higher efficiency for power management devices. (For more information on the key advantages of PowerStack, please refer to www.ti.com/powerstack )

PowerStack products are currently being mass-produced at TI's Clark plant. "The Clark plant is a state-of-the-art assembly and test facility newly operational in the Philippines. We plan to further expand the production of advanced packaging at the Clark plant this year and double production capacity by the third quarter," said Bing Viera, Managing Director of TI Philippines.

More detailed information about the manufacturing of this packaging technology can be found at www.ti.com/powerstack-pr-mfg .

Advanced packaging technology in the analog field
PowerStack packaging technology is another example of TI's innovative approach to packaging, enabling the meeting of the demands of applications requiring higher power density, reliability, and performance at increasingly lower costs. Leveraging its long-standing packaging expertise, TI has built a diverse packaging portfolio in the analog field, offering thousands of diversified products, packaging configurations, and technologies. (For more information on TI's advanced packaging technology, please refer to www.ti.com/powerstack-pr-pkg )

TI's NexFET Power MOSFET Technology
TI's NexFET power MOSFET technology improves energy efficiency in high-power computing, networking, server systems, and power supplies. These high-frequency, high-efficiency analog power MOSFETs enable system designers to access state-of-the-art DC/DC power conversion solutions. More information about TI's NexFET™ Power Blocks can be found at www.ti.com/powerblock-pr .