MOSFET with improved heat dissipation and mounting reliability
Optimized for automotive ECUs with accelerating density


ROHM announced on the 6th that it has developed ultra-small MOSFETs 'RV8C010UN', 'RV8L002SN', and 'BSS84X'.

The new product utilizes Wettable Flank technology to ensure a 125 μm height for the electrode portion on the package side. This technology, which applies plating to the side of the lead frame in bottom-electrode packages such as QFN and DFN, improves soldering characteristics.

The product manufactured in a 1.0 mm × 1.0 mm size shows performance equivalent to that of a 2.9 mm × 2.4 mm size (SOT-23 package) and demonstrates very high solder mounting reliability in automatic optical inspection (AOI) after component mounting, which is important in automotive-related devices that require high quality.

While the mounting area is reduced by approximately 85%, heat dissipation is improved by 65% compared to the SOT-23 package. Therefore, by simultaneously achieving miniaturization and high heat dissipation, it is optimal for applications such as automotive ECUs and ADAS-related devices, where increased functionality is accelerating the increase in board density. Furthermore, the new bottom-electrode package simultaneously achieves miniaturization and high heat dissipation.