TI Launches Industry's First 4MB Flash Memory Device for Harsh Environments
Published2012.11.26 17:23TI Korea (CEO Kent Jeon, www.ti.com/ww/kr ) November 26, 2012 – TI (CEO Kent Jeon) announced the launch of the SM28VLT32-HT, the industry's first high-temperature non-volatile flash memory device for use in harsh environments. Offering a capacity of 4MB, the SM28VLT32-HT significantly reduces costs by eliminating the need for industrial-grade component conformity testing for use within the external temperature range specified in the datasheet. Additionally, it enables data logging even at extreme temperatures and guarantees a minimum operating life of 1,000 hours in harsh environments such as oil and gas exploration, industrial heavy equipment, and aircraft. (For detailed product information, samples, and EVM orders, please refer to http://www.ti.com/sm28vlt32-ht-pr-kr )
Key Features and Advantages of SM28VLT32-HT:
• Widest temperature range: The only non-volatile flash memory device capable of operating over a temperature range of -55°C to +210°C
• High Reliability: Tested across the entire temperature range, robust read/write performance throughout the operating life
• Reduced Design Time: Since external components are not required, applications for harsh environments can be developed more quickly and safely, reducing the time required for development, testing, and verification by up to six months.
• Robust small package: Suitable for use in ceramic flat packs or Known Good Dies (KGDs), the SM28VLT32-HT can be integrated into a multi-chip module, making it suitable for systems with limited board space.
• Serial Interface: Provides an SPI interface to simplify design and packaging and reduce the number of pins.
Packaging, Supply, and Price
SM28VLT32-HT is currently being supplied as a sample in an 8mm x 25mm ceramic flat pack, and the KGD package option and mass production supply are scheduled for the first quarter of 2013.
Tools and Support
An HTFLASHEVM evaluation module featuring a robust board is currently available to facilitate easier evaluation at high temperatures. In addition, customers can post questions on the High Reliability Forum of the TI E2E™ community and receive assistance from TI experts.
Additional portfolio available for high reliability fields
TI’s portfolio of analog and embedded processing products available for high-temperature, high-reliability applications includes the new SM28VLT32-HT, as well as the SM470R1B1M-HT ARM7TDMI™ microcontroller and the SM320F28335-HT Delfino™ digital signal controller.
Links related to TI's high-temperature products:
• Order SM28VLT32-HT Sample: www.ti.com/sm28vlt32-ht-sample-pr
• Order HTFLASHEVM evaluation module: www.ti.com/sm28vlt32-ht-evm-pr
• Download datasheet: www.ti.com/sm28vlt32-ht-ds-pr
• TI’s complete high-temperature ICs and related system block diagrams: www.ti.com/hightemp-pr>
• Download TI's High-Temperature Guide: www.ti.com/hightempguide-pr
TI's High Temperature and High Reliability Products
Customers leverage TI’s accumulated expertise in high-reliability products, the industry’s most comprehensive range of analog and embedded processing products, and various value-added services to meet the demanding requirements of industrial, aerospace, defense, medical, and consumer markets operating in harsh environments. TI provides solutions and services that meet the requirements for extended temperature ranges from -55°C to 220°C, radiation-resistant designs, baseline control, extended product life, aging mitigation, compliance with military standards, ITAR flow support, and proprietary process technologies. TI’s high-reliability packaging includes ceramic, plastic, and Known Good Die (KGD) wafer solutions. (For more information, please visit www.ti.com/hirel )
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