High-quality photos, implementation of immersive AR experiences


There is a growing demand for augmented reality (AR) applications using 3D depth sensors, such as games, virtual e-commerce, and 3D online education.

The market for 3D sensors for smartphone rear cameras is expected to grow to over 500 million units annually in 2024.

The Time of Flight (ToF) technology-based 3D depth sensor developed by Infineon Technologies and pmd Technologies provides innovative consumer convenience with superior performance that surpasses other solutions on the market.

The latest 3D image sensor developed by Infineon and pmd Technologies enables higher quality photos with faster autofocus in low-light conditions and beautiful night mode portraits based on image segmentation. In addition, it provides an unprecedented long-distance range of 10 meters with minimal power consumption, enabling the realization of the most immersive and smart AR experiences.

This new chip can be integrated into a micro camera module to accurately measure depth at near and far ranges for augmented reality (AR). In addition, the imager saves more than 40 percent of power, meeting low power consumption requirements.

The new REAL3™ ToF sensor offers flexible configuration, allowing for differentiated camera performance based on various distances, lighting conditions, and applications, while reducing battery consumption in mobile devices. It provides features such as real-time augmented reality, long-distance scanning, small object reconstruction, high-speed, low-power autofocus, and image segmentation for diverse applications. Effects like background blur in videos or photos of moving scenes can be used regardless of ambient lighting conditions without the need for post-processing.

Furthermore, it can capture high-quality 3D depth data up to 10 meters without compromising resolution at close range, enabling a seamless augmented reality experience. Its low power consumption is highly beneficial for always-on applications, such as mobile AR games, allowing users longer playtime. Using the REAL3™ ToF sensor for 3D scanning for interior reconstruction or 3D mapping for furniture placement and other designs enables twice the measurement distance compared to other solutions on the market.

Mass production of this chip will begin in the second quarter of 2021, and currently only demo kits are available.