Development of a complete and proven equipment solution for hybrid bonding
Establishment of joint programs and COE between the two companies


Applied Materials announced on the 4th that it is collaborating with BE Semiconductor Industry (Besi) to develop a complete and proven equipment solution for die-based hybrid bonding.

Die-based hybrid bonding is a new inter-chip connection technology that enables heterogeneous chip and subsystem design in products related to advanced technologies such as high-performance computing, artificial intelligence (AI), and 5G.

It connects multiple die-shaped 'chiplets' using direct copper interconnects. Through this technology, designers position chiplets of various process nodes and technologies closer together physically and electrically, providing performance equal to or better than that of a single large die.

Hybrid bonding improves overall performance, power, efficiency, and cost by increasing chip density and reducing interconnect wiring lengths between chiplets.

In addition, a complete die-based hybrid bonding equipment solution requires a wide range of semiconductor manufacturing technologies in addition to high-speed, ultra-precision chiplet placement technology. To this end, the joint development program between the two companies combines Applied Materials' expertise in etching, planarization, deposition, wafer cleaning, metrology, inspection, and particle defect control processes with Besi's die placement, interconnect, and assembly solutions.

As traditional 2D scaling slows down, the semiconductor industry is exploring heterogeneous design and chip integration as new ways to improve PPACt (Power, Performance, Space Cost, and Time to Market). To this end, the two companies established a Center of Excellence (COE) focused on next-generation chip bonding technology and created a joint development program.

Based on front-end and back-end expertise, this program provides customers with integrated hybrid bonding configurations and equipment solutions optimized for the entire process.

“We are pleased to combine the semiconductor industry’s leading materials engineering with advanced packaging technology,” said Besi CTO Ruert Boomsma. “The collaboration between the two companies will accelerate the adoption and expansion of hybrid bonding in advanced technology fields such as 5G, AI, high-performance computing, data storage, and automotive.”