December 5, 2012 – Intersil, a global leader in the design and production of high-performance analog and mixed-signal semiconductors, announced today the launch of the ISL8225M, the industry's first fully encapsulated 30A power module. The ISL8225M boasts the highest power density in the industry and dramatically simplifies the design of onboard high-performance power solutions.

The ISL8225M delivers up to 100W of output voltage from a small 17 sq.mm PCB footprint. It can be combined to deliver a single 30A output, or two 15A outputs can be used independently. Through current classification and staged interleaving, up to six modules can be parallelized to achieve an output capability of 180A. It offers high efficiency without heat sinks or fans, and its low thermal resistance makes it sufficient for delivering maximum power.

The simplification of the board-integrated high-performance power supply design is an industry first, enabling the design of high-density and reliable power solutions with only a few external components. In addition, it has the advantage of being configured in a QFN package with external leads, allowing for easy probing and visual soldering inspection.

Features and specifications
• Dual 15A or single 30A output on a 17 sq.mm PCB footprint
• Input voltage range from 4.5V to 20V
• Output voltage range from 0.6V to 6V
• Up to 6 modules can be parallelized to support 180A output flow.
• Maximum power supply possible without a heat sink or fan
• Easy probing and visual solder inspection possible with exposed QFN package leads

Price and Usage Information
The ISL8225M is currently available in a 17mm x 17mm QFN package and is priced starting at $48.85 per 500-unit quantity.