Equipped with soldered RAM, vibration and shock resistant
Suitable for mobile/stationary devices in environments of -40 to 85°C
It can be used in designs capable of real-time processing.


On the 15th, Congatec Korea launched the 'conga-TC570r COM Express,' a new Computer-on-Modules (COM) product based on soldered RAM and 11th generation Intel Core processors with enhanced shock and vibration resistance.

The 'Comm Express Type 6 Compact Module,' with an operating temperature range of -40°C to 85°C, meets shock and vibration resistance requirements for harsh transport conditions. Additionally, it adds price flexibility by enabling Intel Celeron-based products to operate within a temperature range of 0°C to 60°C.

The new COM product line based on Intel 11th Gen Core processors is suitable for mobile OEMs used in outdoor environments, such as trains, commercial vehicles, construction machinery, agricultural vehicles, and autonomous mobile robots. Fixed equipment equipped with shock and vibration resistance features that require CIP protection from situations with a critical impact on operations, such as earthquakes, is also an application field.

For these fields, high-speed data transmission quality in electromagnetic interference (EMI) environments with In-Band Error Fixed Code (IBECC) for single fault tolerance is provided from ultra-high-speed LPDDR4x RAM supporting up to 4266 MT/s.

The package includes durable mounting options for COM and carrier bundles, cooling options, protective film options to prevent corrosion from moisture or condensation, a list of recommended carrier board schematics, and a list of recommended components stable over an extended temperature range. This set of technical features also includes shock/vibration resistance testing, temperature screening, high-speed signal compliance testing, and Congatec's Design-in services and training courses.

The new module, equipped with the latest low-power, high-density 11th Gen Intel Core SoC, provides improved CPU performance and approximately three times higher GPU performance compared to the previous version, along with advanced PCIe Gen 4 support. In addition, it enables durable parallel processing throughput for graphics and computing tasks with up to 4 cores, 8 threads, and up to 96 execution units.

The integrated graphics not only support 8K or 4 × 4K displays but can also be used as a parallel processing unit for convolutional neural networks (CNN) or as an AI and deep learning accelerator. Support for Vector Neural Network Instructions (VNNI) in CPUs with integrated Intel AVX-512 instruction units is another feature that can accelerate AI applications.

Intel’s OpenVINO software toolkit, which includes OpenCV, OpenCL kernels, other industrial tools and libraries, and workloads, supports the acceleration of AI workloads including computer vision, audio, speech, language, and recommendation systems through CPUs, GPUs, FPGAs, etc.

The Thermal Design Power (TDP) is scalable from 12W to 28W, enabling the design of a perfect system using only passive cooling. The conga-TC570r COM Express Type 6 module can be used in designs capable of real-time processing, such as Time-Sensitive Networking (TSN), Time-Coordinated Computing (TCC), and Real Time Systems (RTS) hypervisor support, to consolidate workloads in virtual machine deployment and edge computing scenarios.

Meanwhile, COM Express modules are available in a total of four standard configurations based on 11th generation Intel Tiger Lake processors, and customized designs are also available upon request.