March 6, 2013, Seoul – STMicroelectronics (ST), a global semiconductor company providing a wide range of electronic applications and a leading supplier of high-performance audio ICs, has launched new products in collaboration with Soundchip, a Swiss company that is the original developer of the HD-PA® (High-Definition-Personal-Audio™) reference and a leader in audio system technology innovation. The newly launched products consist of two HD-PA audio engines, STANC0 and STANC1, and one HD-PA microphone, MP34AB01H, which help develop smart audio accessories offering a variety of software-controlled functions.

STANC0 and STANC1 are HD-PA audio engines for controlling sound performance in over-ear, on-ear, and in-ear headsets. Designed for stereo and monaural applications, respectively, they are equipped with Soundchip's patented Soundcore R3™. Soundcore R3 provides a hybrid analog-to-digital architecture capable of zero-latency sound processing with an optimal dynamic range of 100dB.

The STANC0 and STANC1 can provide powerful digital configuration feedback and feedforward ANC[1] processing, enabling the cancellation of unwanted noise. In addition, digital binaural monitoring is possible, allowing for comfortable, uninterrupted conversation and natural open-ear listening.

Unlike competing products that configure ANC filters by selecting and placing hundreds of passive components around the 'noise cancellation' OP amp, STANC0 and STANC1 integrate these filters on-chip. Filter and device settings are digitally programmed to optimize performance with connected audio systems or enable real-time configuration with complementary DSPs. As an example of such a complementary DSP, the STM32F4 can implement new and exciting features such as automatic ANC and augmented reality.

STANC0 and STANC1 are highly integrated devices supplied in a small 4.5mm x 4.5mm LF-BGA package. These two devices can operate on a single AAA battery or a host power supply, making them suitable for the wired and wireless components market as well as for standard audio accessories.

"With ST's latest HD-PA devices, customers will be able to create new innovations in the personal audio field and develop next-generation ANC headsets and smart audio accessories with exceptional sound," said Mark Donaldson, CEO of Soundchip.

"ST is a global leader in integrated circuit and MEMS design and mass production. The collaboration between ST and Soundchip, and the resulting launch of new HD-PA components, demonstrates ST's strong commitment to the audio sector, particularly in smart audio," said Andrea Onetti, General Manager of ST's Audio & Sound business unit.

The MP34AB01 is a compact 3.76mm x 2.95mm analog, bottom-port, HD-PA grade MEMS silicon microphone specifically designed to be combined with ST's HD-PA audio engine. It features a constant audio response between 20Hz and 20kHz, an excellent 66dB SNR, zero-latency output, and surface-mount assembly, making it a perfect match for the STANC0 and STANC1. It accurately and reliably measures the in-ear and ambient sound conditions necessary to effectively drive feedback and feed-forward ANC.

Components for HD-PA are supported by Soundstation™ computer design and manufacturing tools to simplify product development and significantly improve manufacturing reliability. Component samples and evaluation boards are available for sale only to customers who sign a Non-Disclosure Agreement (NDA).