March 27, 2013, Seoul, Korea – Freescale Semiconductor (NYSE: FSL), a global leader in high-power RF (radio frequency) power transistors, recently achieved an unprecedented milestone by shipping over 175 million high-power, high-frequency RF power transistors in plastic packages.

Freescale's RF power overmolded plastic package provides a cost-effective and reliable alternative compared to more expensive conventional metal ceramic packages. Freescale's plastic packages can withstand and dissipate the high levels of heat generated in RF power transistors while maintaining optimal performance levels. This packaging technology is typically significantly less expensive per unit compared to comparable ceramic (air-cavity) packages, and the overmolded plastic devices support more efficient automated assembly, allowing customers to simplify their manufacturing processes.

Ritu Favre, Vice President and General Manager of Freescale's RF Business Unit, stated, "Freescale not only pioneered high-power RF package technology to meet the demanding requirements of power amplifier manufacturers, but will continue to set the standard in performance, thermal operating temperature, reliability, and production volume of plastic packages." She further noted, "Surpassing 175 million shipments of plastic package RF power devices is a remarkable achievement that demonstrates Freescale's innovative plastic packaging technology is widely recognized in the market."

Freescale's leadership in plastic packaging has been maintained for over 30 years. In the mid-1980s, Freescale pioneered low-frequency, high-power plastic packages used in automotive and industrial applications. In 1997, it became the first in the industry to ship high-power, high-frequency RF devices in plastic packages optimized for wireless infrastructure applications. Nine years later, Freescale introduced a plastic 2GHz RF power device with a maximum operating temperature rating of 225°C. This product was the first to achieve frequency, thermal performance, maximum operating temperature, standards compliance, and reliability comparable to conventional metal-ceramic package RF transistors. In 2009, Freescale further strengthened its technological leadership in plastic packaging by introducing the OMNI overmolded plastic package, designed for applications where extreme power, performance, and temperature conditions are commonplace.

Freescale offers the industry's broadest portfolio of plastic package RF power devices with 12 different package types. The current portfolio includes 2-stage and 3-stage driver ICs as well as 2-stage and discrete final stages. The output power range of devices in the product family extends from 0.1W to a maximum of 300W, with frequencies ranging from 10MHz to 2.7GHz. Additionally, Freescale continues to make necessary investments in research and development to meet the requirements of the rapidly evolving and demanding RF industry.