May 9, 2013, Seoul – Infineon Technologies (Korea CEO Lee Seung-soo) has successfully launched products featuring TIM (thermal interface material) developed to reduce contact resistance between the metal surface of power semiconductors and heat sinks. Customers using the new EconoPACK™+ D series products are directly experiencing significantly improved conductivity with this thermal conductive paste. As customer demand increases, Infineon plans to rapidly expand the range of products incorporating TIM. In the first quarter of 2014, Infineon plans to supply 62mm EconoDUAL™ 3 and PrimePACK™ 2 product families with TIM. By the first half of 2014, TIM will be applied to EconoPACK™ 4, PrimePACK™ 3, and Econo 2 and 3 product families, while TIM material application to Easy 1B and 2B, Smart 2 and 3, and IHM/IHV series is scheduled for 2015.

To respond to steadily increasing demand, Infineon has established a production line for applying TIM to modules at its power semiconductor backend assembly site in Cegléd, Hungary. This thermal conductive material is applied to modules using a stencil printing process. By implementing a precise and quality-assured process, optimal bonding characteristics are achieved when joining the module and heat sink. Special technical processes and equipment have been developed for this manufacturing process.

Dr. Martin Schulz, Application Engineering Verification Manager at Infineon Technologies, stated, "The TIM material and the process Infineon has developed for applying this paste enable maximum effectiveness that was previously impossible to achieve. With power density continuously increasing, it is now possible to plan thermal prediction more accurately during the application design phase."

TIM (thermal interface material) significantly reduces contact resistance between the metal portion of power semiconductors and heat sinks. In the case of the new D series of EconoPACK™+, contact resistance between the module and heat sink has been reduced by approximately 20 percent. This optimized thermal transfer improves module lifespan and reliability. Since this material provides reliable and improved thermal contact resistance characteristics from the moment the module is first turned on, it does not require a separate burn-in cycle that is commonly used in many competing materials exhibiting phase change characteristics. TIM is silicon-free and electrically non-conductive.