May 27, 2013, Seoul – Infineon Technologies (Korea Representative Director Seung-soo Lee) introduced a new TO-Leadless package that offers reduced package resistance, significantly smaller size, and enhanced EMI performance. The latest generation of OptiMOS™ MOSFETs are available in a TO-Leadless package, making them highly suitable for high-power and reliability-critical applications such as forklifts, light electric vehicles (LEVs), point-of-load (PoL), and communication systems.

The new TO-Leadless package is designed for high-current applications up to 300A. Due to its low package resistance, this package provides the lowest RDS(on) across all voltage ratings. Additionally, it enables a very compact design by being 60 percent smaller than the D2PAK 7-pin package. The TO-Leadless reduces the footprint by 30 percent, occupying less board space in applications such as forklifts. Its 50 percent lower height makes it highly useful for compact applications like rack servers or blade servers. Furthermore, it achieves improved EMI performance through low package parasitic inductance.

Richard Kuncic, Senior Director of Low Voltage Power Conversion at Infineon Technologies, said, “Infineon has become the first semiconductor company to offer 0.75mohm 60V MOSFETs by utilizing TO-Leadless. This package enables a reduction in the number of parallel MOSFETs and an increase in power density in forklift applications.” “The TO-Leadless package offers many advantages for high-power applications requiring maximum efficiency and reliability,” he said.

Furthermore, TO-Leadless provides a 50 percent larger solder contact area, thereby lowering current density. This prevents electron migration at high current levels and temperatures, thus improving reliability. Additionally, unlike other leadless packages, TO-Leadless enables optical inspection by adopting tin-plated groove leads.

The TO-Leadless package is the optimal solution for high-power applications requiring maximum efficiency, outstanding reliability, excellent EMI performance, and superior thermal performance.

supply
Currently, TO-Leadless samples of 30V (0.4mohm max.), 60V (0.75mohm max.), 100V (2.0mohm max.), and 150V (5.9mohm max.) products are being supplied, and mass production supply is scheduled to begin in the third quarter of 2013.