ACM Research, Inc., a leader in wafer handling solutions for semiconductor and advanced WLP (Wafer-Level Packaging) applications, is expanding business and collaboration opportunities by securing orders for SAPS demo equipment from major global semiconductor manufacturers.

ACM Research announced on the 10th that it has received an order for a trial version of its Ultra C SAPS full-surface cleaning equipment from a major global semiconductor manufacturer. The equipment is scheduled to be installed at the customer's development fab in China during the first quarter of 2022.

“This order from a global semiconductor company operating a fab in China is a tremendous opportunity for us,” said Dr. David Wang, CEO of ACM Research. “This semiconductor company decided to evaluate ACM’s SAPS technology as part of its efforts to improve its R&D capabilities and production processes.” “By successfully completing this equipment evaluation, we look forward to continuing more business and cooperation opportunities with this client as well as other key customers in the region,” he said.

ACM’s proprietary SAPS™ (Space Alternated Phase Shift) advanced wafer cleaning technology utilizes the phase shift of megasonic waves in the gap between the megasonic transducer and the wafer. Unlike the fixed megasonic transducers used in conventional megasonic wafer cleaning systems, SAPS technology moves or tilts the transducer while the wafer rotates, ensuring that megasonic energy is delivered uniformly to every point on the wafer even when the wafer is warped. SAPS technology offers significantly faster processing speeds than conventional megasonic cleaning methods and does not damage the wafer surface or cause material loss. Furthermore, SAPS technology has demonstrated the ability to achieve more thorough and comprehensive cleaning capabilities without compromising device functionality, even in sub-10 nanometer ultrafine processes.