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Samsung Electronics Strengthens Foundry's Cutting-Edge Process-Based Chip Implementation Solutions

Google 우선 소스Published2021.11.19 12:28



Innovation through 3nm design infrastructure, AI EDA, and 2.5D/3D packages.
Samsung Electronics is strengthening its cutting-edge foundry solutions with △3nm design infrastructure △AI EDA technology △2.5D/3D packaging.

Samsung Electronics announced that it will hold the 'SAFE (Samsung Advanced Foundry Ecosystem) Forum 2021' starting on the 18th and will strengthen the foundry ecosystem together with its partners.

The 'SAFE Forum', now in its third year, discussed ways to strengthen solutions necessary for implementing cutting-edge process-based chips under the theme of 'Performance Platform 2.0'.

Additionally, successful development collaboration outcomes and cases through the SAFE platform were shared through seven keynote speeches and 76 tech sessions.

In his keynote speech, Lee Sang-hyun, Executive Vice President of Design Platform Development at Samsung Electronics' Foundry Business Division, said, "The transition to a data-centric era is accelerating, and Samsung Electronics' ecosystem is also evolving to meet the growing needs of customers." He added, "Samsung Electronics is a strong supporter of the SAFE program, which is comprised of 'Innovation,' 'Intelligence,' and 'Integration.'"We will lead the realization of the vision of ‘Performance Platform 2.0’ that has been upgraded to a ‘Performance Platform 2.0’”

At this SAFE forum, Samsung Electronics expanded its infrastructure with partners across all foundry sectors, including electronic design automation (EDA), cloud, design assets (IP), design solution partners (DSP), and package solutions in the HPC/AI field required for the data-centric era.

We have secured over 80 EDA tools and technologies, including a design infrastructure optimized for the 3nm GAA (Gate-All-Around) structure scheduled for mass production in the first half of 2022, a 2.5D/3D package design solution, and an AI-based EDA for systematically managing and analyzing design data. Additionally, design time was shortened by introducing new technologies such as computing methods utilizing GPUs.

The Cloud Design Platform (CDP) supports hybrid cloud functionality that can be linked to customers' existing design environments, and enhances customer convenience by expanding the pre-installation of software required for design.

By working with 12 global design solution partners, we actively support innovative semiconductor development by domestic and international fabless companies by leveraging not only cutting-edge processes but also high-performance, low-power semiconductor design know-how.

It provides over 3,600 application-specific interface IPs, including high-performance SerDes (Serializer-Deserializer) IPs used in networks, data centers, etc., as well as PCIe and eUSB.

By expanding the OSAT ecosystem, we plan to secure diverse packaging solutions, including 2.5D/3D, and lead the 'Beyond Moore' era.

Meanwhile, domestic fabless companies are strengthening the competitiveness of the domestic system semiconductor industry by developing new products using Samsung Electronics' advanced technology-based SAFE platform.

AI semiconductor fabless startup 'FuriosaAI' has developed AI semiconductors for data centers and edge servers in collaboration with Samsung Electronics' DSP partner 'SemiFive'.

“Furiosa AI designed the highest-performance AI semiconductor ‘Warboy’ through SemiFive’s SOC platform, and was able to quickly enter the global AI semiconductor market by producing and verifying a prototype at Samsung Electronics,” said Baek Jun-ho, CEO of ‘Furiosa AI.’ “We also gained ideas for implementing the next-level AI semiconductor at this SAFE forum.”"Everyone said," he said.

In addition, Lee Jang-gyu, CEO of Telechips, a domestic automotive fabless company, said, “We are currently designing a product that uses Samsung Electronics’ 8nm process,” and “We will promote wide-ranging cooperation with various partners, from IP to packaging, through the SAFE forum and increase the completeness of the product in a short period of time.”

This forum will be open to the public until the 18th of next month (Korean time) through the SAFE Forum 2021 website (https://www.samsungfoundryevent.com/safe2021).
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